Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Abstract

Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.

Effect of graphene oxide on tensile and flexural properties of carbon/glass hybrid fiber‐reinforced polymer composite

“…At a temperature above 450°C, the carbon shelf decomposed, causing a gradual end of the decomposition process. [ 24,25 ]…”

“…At a temperature above 450 C, the carbon shelf decomposed, causing a gradual end of the decomposition process. [24,25] Table 2 outlines the thermal stability of modified composites with different GO loading values. Notably, the residual amount of pure resin at 700 C is different.…”

Silane‐functionalized graphene oxide/epoxy resin nanocomposites: Dielectric and thermal studies

“…Despite the low effect of different modifiers on the T g values as they showed a small change of about ±2% (Table ). Sample CE/GO has T g value 140 °C that might be due to the presence of some aggregations, which restrict the mobility of the epoxy polymeric chains . On the other hand, the thermal stability of the resin is significantly affected by the addition of small amounts of the fillers.…”

High‐thermal‐conduction and low‐cost composite originated from the tight packing structure of boron nitride sheets and binary alumina balls

“…[ 11–13 ] Therefore, current research on thermally conductive composites has mainly focused on uniformly dispersing small‐sized fillers and regulating the arrangement of fillers. [ 6,14–17 ] By constructing heat conduction paths through three‐dimensional (3D) network, the high thermal conductivity of the material can be obtained. [ 18–21 ]…”