Alternative technology for SMD components connection by non-conductive adhesive on a flexible substrate

Hirman, Martin; Navrátil, Jǐŕı; Steiner, František; Dzugan, Tomas; Hamáček, Aleš

doi:10.1007/s10854-019-01789-w

Cited by 9 publications

(8 citation statements)

References 19 publications

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“…First, a few hypotheses were proposed based on experience from our previous research. 41 Our main experimental hypothesis was that the electrical resistance of soldered/NCA bonded joints between SMD component metallizations and conductive textile ribbons is reliable during accelerated aging. Another hypothesis was that stretching of the ribbons at 150% of their relaxed length during soldering/gluing can improve the sample properties and reliability during aging by mechanical stress.…”

Section: Experiments: Materials and Methodsmentioning

confidence: 99%

“…35 In addition, an alternative method using a NCA to fix components onto a substrate and a conductive joint made by direct contact of a component with a substrate is possible. 36 The use of soldering 37 (strictly maintaining the temperature) or ECAs 38 and NCAs seems to be the easiest and most inexpensive way for contacting nearly all types of SMD components to textiles while maintaining wearing comfort and good reliability. 39 The soldering and ECA techniques create electrical contact between components and conductive threads by solder or conductive particles in the adhesive.…”

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confidence: 99%

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Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Hirman

Navrátil

Steiner

et al. 2022

Textile Research Journal

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This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 Ω even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70°C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 mΩ, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150°C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.

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Section: Experiments: Materials and Methodsmentioning

confidence: 99%

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confidence: 99%

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Hirman

Navrátil

Steiner

et al. 2022

Textile Research Journal

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“…A benefit of this technique is the possibility of adhesives curing at room temperature. Thus, thermal treatment impacting the assembly can be avoided [47]. In terms of weaker thermal resilience of biodegradable substrates, adhesives that can be also biocompatible and water-soluble need to be adopted.…”

Section: Assemblingmentioning

confidence: 99%

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Géczy

Farkas

Kovács

et al. 2022

IEEE Open J. Nanotechnol.

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Biodegradables are a promising path for the future of electronics in a greener mindset. The review study focuses on their applications and past and current research results. The paper also investigates the application of nanomaterials as fillers to control or increase the physical (electrical, mechanical, thermal) properties of biodegradable biopolymers. These biodegradables and nanocomposites are already effectively used in prototypes and advanced application areas with demanding requirements, such as flexible and wearable electronics, implantable or biomedical applications, and traditional commercial electronics. The nanoenhanced biopolymer substrates (e.g., with improved gas and water barrier functionalities) sometimes also with integrated, nanoenabled functionalities (such as electromagnetic shielding or plasmonic activity) can be beneficial in many electronics packaging and nanopackaging applications as well.

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“…The disadvantage of this process is the long curing time, and another process step is necessary for encapsulation. Another possibility is adhesive bonding with a nonconductive adhesive (NCA) to fix the components onto the substrate, and a conductive joint made by the direct contact of a component with a substrate is possible [14]. The problem with thermosetting adhesives is their long curing times, but a UV-curable adhesive with almost instant curing can be used.…”

Section: Introductionmentioning

confidence: 99%

“…The soldering and ECA techniques create electrical contact between components and conductive threads via solder or conductive particles in the adhesive. The NCA contact technique creates direct contact between conductive threads and the component pad (by using mechanical pressure), and the adhesive is only used for fixing this mechanical contact [14]. UV light curing is possible for an NCA.…”

Section: Introductionmentioning

confidence: 99%

Influence of Sweat on Joint and Sensor Reliability of E-Textiles

et al. 2022

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This article addresses reliability under the sweat of interconnection techniques for the mounting surface mounted device (SMD) components and fully printed humidity sensors onto conductive stretchable textile ribbons. Samples underwent testing for the effect of ageing by artificial sweat on their electrical resistance using both alkaline and acidic artificial sweat. The best results in terms of electrical resistance change were obtained for samples soldered to the conductive fibers interwoven in the ribbon. However, this method can damage the ribbon due to the high temperature during soldering and significantly reduce the mechanical properties and flexibility of the ribbon, which can lead to a limited service life of samples. On the other hand, adhesive bonding is a very interesting alternative, where the above-mentioned properties are preserved, but there is a significant effect of sweat ageing on electrical resistance. The results of fully printed graphene-based humidity sensors show that, for the intended use of these sensors (i.e., detection of changes in moisture on the human body), usage of the samples is possible, and the samples are sufficiently reliable in the case of sweat degradation. In addition, the response of the sensor to humidity is quite high: 98% at a relative humidity of 98%.

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Alternative technology for SMD components connection by non-conductive adhesive on a flexible substrate

Cited by 9 publications

References 19 publications

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Influence of Sweat on Joint and Sensor Reliability of E-Textiles

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