Alternative fine pitch solution of low cost and high throughput thermal compression bonding by using capillary underfill

Tsai, Mike; Lan, Albert; Yao, Yan Han; Wu, Meng Yueh; Chang, C.; Lo, Roger; Chen, Eason

doi:10.1109/ectc.2015.7159632

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015

DOI: 10.1109/ectc.2015.7159632

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Alternative fine pitch solution of low cost and high throughput thermal compression bonding by using capillary underfill

Mike Tsai

Albert Lan

Yan Han Yao

et al.

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Cited by 10 publications

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Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

Lin

et al. 2016

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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Alternative fine pitch solution of low cost and high throughput thermal compression bonding by using capillary underfill

Cited by 10 publications

References 10 publications

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

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