2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.46
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Alternative 3D Small form Factor Methodology of System in Package for IoT and Wearable Devices Application

Mike Tsai
1
,
Albert Lan
2
,
Chi Liang Shih3
et al.
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Cited by 13 publications
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