2019
DOI: 10.1038/s41467-019-13176-4
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All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration

Abstract: 3D monolithic integration of logic and memory has been the most sought after solution to surpass the Von Neumann bottleneck, for which a low-temperature processed material system becomes inevitable. Two-dimensional materials, with their excellent electrical properties and low thermal budget are potential candidates. Here, we demonstrate a low-temperature hybrid co-integration of one-transistor-one-resistor memory cell, comprising a surface functionalized 2D WSe2 p-FET, with a solution-processed WSe2 Resistive … Show more

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Cited by 123 publications
(141 citation statements)
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References 66 publications
(64 reference statements)
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“…Graphene and related two-dimensional (2D) materials are a family of exciting materials, which are as small as one to three atoms in vertical direction, but extremely large in horizontal space [1][2][3][4][5]. These systems have attracted significant attention for nanoelectronics and optoelectronics [6][7][8][9][10], non-von Neumann architecture computing [11,12], hybrid flexible and stretchable electronics [13][14][15], and many other applications. As a consequence of their extremely high market value, 2D materials are very attractive to many industries.…”
Section: Introductionmentioning
confidence: 99%
“…Graphene and related two-dimensional (2D) materials are a family of exciting materials, which are as small as one to three atoms in vertical direction, but extremely large in horizontal space [1][2][3][4][5]. These systems have attracted significant attention for nanoelectronics and optoelectronics [6][7][8][9][10], non-von Neumann architecture computing [11,12], hybrid flexible and stretchable electronics [13][14][15], and many other applications. As a consequence of their extremely high market value, 2D materials are very attractive to many industries.…”
Section: Introductionmentioning
confidence: 99%
“…However, previous relevant studies, including those on electronic and phonon transport, have focused on micrometer-sized TMDCs obtained via mechanical exfoliation or CVD. [43,[46][47][48] To the best of our knowledge, no experimental studies have been conducted on large-area ML WSe 2 of the size 4 × 6 mm 2 as an intermediate layer in LSSE spin transport. To achieve this, we used a novel PVD method with WSe 2 powder at 650 °C for growing millimeter-scale large-area ML WSe 2 (see Experimental and Material Characterization sections).…”
Section: Discussionmentioning
confidence: 99%
“…Volatile switching and nonvolatile switching behaviors can even coexist and interconvert in the same device with appropriate conditions. [13][14][15][16] A great number of materials have been explored as active layer and electrodes for volatile memristors in the past few decades (see Table 1). The active layer materials Ruopeng Wang received a B.S.…”
Section: Methodsmentioning
confidence: 99%