2021
DOI: 10.1007/s13320-021-0640-7
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All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

Abstract: This paper presents an all-SiC fiber-optic Fabry-Perot (FP) pressure sensor based on the hydrophilic direct bonding technology for the applications in the harsh environment. The operating principle, fabrication, interface characteristics, and pressure response test of the proposed all-SiC pressure sensor are discussed. The FP cavity is formed by hermetically direct bonding of two-layer SiC wafers, including a thinned SiC diaphragm and a SiC wafer with an etched cavity. White light interference is used for the … Show more

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Cited by 21 publications
(13 citation statements)
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“…For example, ber-optic cables placed close to highways and railways can give the wrong signal to a passing vehicle and not see the real problem. In addition, the cost of false alarms is high due to the installation of ber-optic early warning in the remote area [2]. erefore, it is very important to determine the signal vibration of a ber optic cable.…”
Section: Introductionmentioning
confidence: 99%
“…For example, ber-optic cables placed close to highways and railways can give the wrong signal to a passing vehicle and not see the real problem. In addition, the cost of false alarms is high due to the installation of ber-optic early warning in the remote area [2]. erefore, it is very important to determine the signal vibration of a ber optic cable.…”
Section: Introductionmentioning
confidence: 99%
“…The advantage of this type is that it is less affected by temperature; however, it suffers from the drawback that the sensor chip is easily disturbed by parasitic capacitance signals. The optical fiber type mainly uses the SiC substrate as structural support [22][23][24] and the optical fiber as the pressure sensor. This method can realize pressure measurements at higher temperatures, but the modulation and demodulation of the optical signal is complicated.…”
Section: Microelectromechanicalmentioning
confidence: 99%
“…Silicon-based piezoresistive pressure sensors are easy to integrate with electronic devices, the response is more linear and is not affected by RF noise in nature, mainly using polysilicon as an elastomer, using advanced miniaturization manufacturing process to integrate silicon diaphragm as a sensitive component, based on the piezoresistive effect of polysilicon or silicon, the piezoresistive material is deformed under stress, and the resistivity changes due to the change of carrier mobility, which affects its resistance value [1][2][3][4][5] . In this paper, the sensitivity of the piezoresistive pressure sensor is calculated by using the COMSOL finite element software to calculate the output voltage of different thickness films at different pressures, and its high sensitivity and linearity are verified [6][7][8][9][10] .…”
Section: Introductionmentioning
confidence: 99%