Algorithms for transient three-dimensional mixed-level circuit and device simulation

Mayaram, K.; Chern, Jue-Hsien; Yang, Ping

doi:10.1109/43.248083

Cited by 15 publications

(4 citation statements)

References 16 publications

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“…9 [58]. The two domains are tied together by the boundary conditions at contacts, and the solution to both sets of equations is rolled into one matrix solution [155], [156]. The advantage is that only the struck device is modeled in multiple dimensions, while the rest of the circuit consists of computationally efficient SPICE models.…”

Section: Mixed Device/circuit Simulationsmentioning

confidence: 99%

Basic mechanisms and modeling of single-event upset in digital microelectronics

Dodd

Massengill

2003

IEEE Trans. Nucl. Sci.

896

427

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Physical mechanisms responsible for nondestructive single-event effects in digital microelectronics are reviewed, concentrating on silicon MOS devices and integrated circuits. A brief historical overview of single-event effects in space and terrestrial systems is given, and upset mechanisms in dynamic random access memories, static random access memories, and combinational logic are detailed. Techniques for mitigating single-event upset are described, as well as methods for predicting device and circuit single-event response using computer simulations. The impact of technology trends on single-event susceptibility and future areas of concern are explored.

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Section: Mixed Device/circuit Simulationsmentioning

confidence: 99%

Basic mechanisms and modeling of single-event upset in digital microelectronics

Dodd

Massengill

2003

IEEE Trans. Nucl. Sci.

896

427

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“…Special coupling algorithms and time-stepping schemes are required to enable fast simulation of microsystems. Therefore, a tight coupling between the circuit and device simulators is necessary for simulation efficiency [9], [10].…”

Section: Coupled Circuit-device Simulationmentioning

confidence: 99%

An integrated simulator for coupled domain problems in MEMS

Kirby

Karniadakis

Mikulchenko

et al. 2001

J. Microelectromech. Syst.

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An integrated circuit and microfluidic simulator is presented in this paper. It allows coupled simulation of flow, structure, thermal, and electrical domains. The overall architecture and various algorithms including the coupling of the circuit and microfluidic simulators are described. An application of the simulator is demonstrated for a controlled microliquid dosing system using detailed numerical models for the fluid field, a low-dimensional model for the flow sensor, and circuit elements for the electronic control. Unlike other simulators which employ mostly lumped models for the various components, we formulate here a methodology for distributed systems.

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“…The mixed device/circuit simulation of an SEU has been increasingly used recently, where the struck device is modelled in the “device domain” using multi‐dimensional device simulation, whilst the rest of the circuit is represented by SPICE‐like compact circuit models. The two domains are tied together by the boundary conditions at contacts, and the solution to both sets of equations is rolled into one matrix solution . The advantage is that only the struck device is modeled in multiple dimensions, whereas the rest of the circuit consists of computationally efficient SPICE models.…”

Section: Introductionmentioning

confidence: 99%

Dependability evaluation of integrated circuits at design time against laser fault injection

Yuan

2011

Security Comm Networks

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Laser fault injection has been proved to be a useful tool for attacks on integrated circuits. Transistors hit by a pulse of photons causes them to conduct transiently, thereby introducing transient logic errors, such as register value modifications, memory dumping, and so on. Attackers can make use of this abnormal behavior and extract sensitive information that the devices try to protect. This paper demonstrates laser fault injection attacks on very-large-scale integration circuits in a semi-invasive way for the purpose of validating fault tolerant design and performance. Then, the paper presents a simulation methodology to evaluate the dependability of the integrated circuit design against laser fault injection attacks at design time. This simulation methodology involves exhaustively scanning the layout, incorporating the exposed cells into a circuit simulator, and examining the response of the circuit in detail. Experiments conducted on the same test chip spot the same vulnerabilities, thus indicating the validity of the proposed simulation methodology.

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Algorithms for transient three-dimensional mixed-level circuit and device simulation

Cited by 15 publications

References 16 publications

Basic mechanisms and modeling of single-event upset in digital microelectronics

Basic mechanisms and modeling of single-event upset in digital microelectronics

An integrated simulator for coupled domain problems in MEMS

Dependability evaluation of integrated circuits at design time against laser fault injection

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