2009
DOI: 10.1134/s1063782609040253
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AlGaN/GaN-HEMTs with a breakdown voltage higher than 100 V and maximum oscillation frequency f max as high as 100 GHz

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Cited by 15 publications
(7 citation statements)
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“…In literature it has already been noted [13] that in the general case the expressions (14)- (17), defining the limit values of high frequency parameters of field-effect transistors, do not work for the real transistors with various n and d values. The authors in [13] suppose that it can be associated with not taking into account the influence of some (so-called parasitic) components R s and R d of the external transistor EC (Table 2). With these corrections, according to [13], the expressions for f T and f max have the following form:…”
Section: Discussion Of the Experimental Resultsmentioning
confidence: 99%
See 3 more Smart Citations
“…In literature it has already been noted [13] that in the general case the expressions (14)- (17), defining the limit values of high frequency parameters of field-effect transistors, do not work for the real transistors with various n and d values. The authors in [13] suppose that it can be associated with not taking into account the influence of some (so-called parasitic) components R s and R d of the external transistor EC (Table 2). With these corrections, according to [13], the expressions for f T and f max have the following form:…”
Section: Discussion Of the Experimental Resultsmentioning
confidence: 99%
“…The authors in [13] suppose that it can be associated with not taking into account the influence of some (so-called parasitic) components R s and R d of the external transistor EC (Table 2). With these corrections, according to [13], the expressions for f T and f max have the following form:…”
Section: Discussion Of the Experimental Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…Pulsed ionizing laser radiation is also used for on-line testing of electronic equipment as when it is absorbed in semiconductor structures, a photocurrent pulse occurs generated as a result of electron-hole pairs formation. Testing can be held of both manufactured semiconductor devices with no upper part of the casing over the crystal, and waffer pattern structures using probe methods at the earliest stages of electronic device fabrication [5,6].…”
Section: Introductionmentioning
confidence: 99%