Al/stainless-invar composites with tailored anisotropy for thermal management in light weight electronic packaging

Opposite Thermal Expansion in Isostructural Noncollinear Antiferromagnetic Compounds of Mn3A (A = Ge and Sn)

“…For example, due to their weak metallic bonds, metals based compounds generally have a strong PTE, e.g., Al (α l = 23.1 × 10 –6 /K), Cu (α l = 17.7 × 10 –6 /K), and Fe (α l = 11.8 × 10 –6 /K) . To meet the requirement for a low coefficient of thermal expansion (CTE), metal matrix composites (MMCs) are often fabricated by adding fillers with low or negative thermal expansion, such as Cu/ZrW 2 O 8 composites, Al­(Si)/Diamond, Al/stainless-invar, and Al/SiC . It is well-known that metals based compounds are normally benefitted by advantages such as high mechanical strength and good electrical and thermal conductivities.…”