Ageing and degradation of poly(ethylene terephthalate) in an oxygen plasma

Friedrich, Jörg; Loeschcke, I.; Frommelt, H.; Reiner, Hans-Dieter; Zimmermann, Heinz; Lutgen, Pierre

doi:10.1016/0141-3910(91)90099-d

Cited by 70 publications

(32 citation statements)

References 29 publications

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“…From these NEXAFS and XPS results, we expected that the phenyl ring was cleaved after the treatment and -COOH and -OH groups were formed at the cleaved sites [17,26]. Spectra of the annealed sample were not changed significantly compared with VUV/O 3 -treated one.…”

Section: B Results Of Xps Analysismentioning

confidence: 85%

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NEXAFS and XPS studies of VUV/O<inf>3</inf> treated aromatic polyurea for high-speed electrophoresis microchips

Shinohara

Nakahara

Shoji

et al. 2011

2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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This research studies on VUV/O 3 -treated aromatic polyurea film from near-edge X-ray absorption fine structure (NEXAFS) and X-ray photoelectron spectroscopy (XPS) spectra. These spectra indicate that the benzene ring was cleaved after the treatment, and carboxyl and hydroxyl groups were formed at the cleaved sites. The VUV/O 3 -treated polyurea was applied to polymethylmethacrylate (PMMA) microchip for microchip electrophoresis (MCE) of bovine serum albumin (BSA). Fast electroosmotic mobility of 4.6×10 -4 cm 2 V -1 s -1 was realized as well as reduction of the BSA adhesion. This functional surface is useful for high speed MCE analysis.

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Section: B Results Of Xps Analysismentioning

confidence: 85%

“…All spectra were compensated assuming that the C1s C-C/C-H peak appears at a binding energy of 285.0 eV. Expected peak assignments were referred to [17][18][19][20][21][22].…”

Section: B Surface Analysismentioning

confidence: 99%

NEXAFS and XPS studies of VUV/O<inf>3</inf> treated aromatic polyurea for high-speed electrophoresis microchips

Shinohara

Nakahara

Shoji

et al. 2011

2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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“…Plasma has been widely used for surface cleaning, for instance, oxygen ECR (electron cyclotron resonance) plasma was used to remove organic contaminants on silicon wafer [3]. Plasma also can be used to decomposed the structure of organic compounds, for example, poly(ethylene terephalate) (PET) could be aged and degraded in an oxygen plasma [4]. In this work, for improving solder joint in a TCNCP process, the OSP finished substrate was treated by argon-oxygen microwave plasma.…”

Section: Introductionmentioning

confidence: 99%

Removed organic solderability preservative (OSPs) by Ar/O<inf>2</inf> microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng

Chen

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Organic soderability preservative (OSP) is the cheapest metal surface finish to apply for corrosion inhibition of bare copper. In conventional flip chip process, the various OSPs could be dissolved by rosin pre-fluxes before the chip placement to enable solder bonding. The thermal compression flip chip bonding with non-conductive paste (TCNCP) process is one type of no-flow underfill process. In a TCNCP process, the OSP layer must dissolve in self-fluxing agent in NCP, but the process does not have adequate time for allowing complete dissolution to occur. In order to assist in OSP removal, this work attempted to Ar/O 2 microwave plasma to remove the OSP layer on Cu trace of a substrate. The SEM-FIB investigation revealed that almost all of OSP layer could be removed with plasma, while only few OSPs remained in the relatively deep concavity on the surface of Cu trace. The analysis results by SEM-EDX showed that the carbon content of the treated plasma residue decreased from 44.69% to 11.5%. The Raman spectrum also showed that the bands of vibration mode in benzimidaozle almost disappeared, indicating the successful removal of the OSP layer by Ar/O 2 microwave plasma. The cross-sectional SEM image of the bump on trace produced with the TCNCP process indicated that thin intermetallic compound (IMC) layer formed at the solder/Cu trace interface when incorporated with Ar/O 2 microwave plasma pre-treatment. The SEM-DEX composition analysis delineated that the IMC layer consists of Cu 3 Sn and Cu 6 Sn 5 . These results indicate the successful removal of OSP.

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“…Unfortunately the permanency of this modification is limited for about seven days. Better hydrophilic effect stabilization can be achieved with the combination of plasma modification and special pre-treatment methods applying dimethylsulfoxide, dimethylformamide and special diluents [3]. Further possibility seems to be the application of plasma containing gas characterized with strong electron affinity (e.g.…”

Section: Introductionmentioning

confidence: 99%

PES fabric plasma modification

et al. 2004

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Polyester ranks the upper position in the world fiber production -nearly 54 % of the total production of synthetic fibers. Troubles connected with minimizing of the textile hydrophobicity are usually being solved by the textile fibers' surface chemical modification, but from ecological point of view modification of fabric with low temperature plasma is superior to classical chemical wet processes. Application of various plasmas for PES treatment has been already described. To compare the effectiveness of different plasma sources we performed a series of experiment both in RF and MW plasmas. For working gas nitrogen, oxygen and their mixtures were employed. Internal plasma control was provided by measurement of optical emission spectra. The hydrophilicity degree was determined by the drop test. Paper discusses optimal conditions of the PES fabric plasma treatment.PACS: 52.80.Pi

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Ageing and degradation of poly(ethylene terephthalate) in an oxygen plasma

Cited by 70 publications

References 29 publications

NEXAFS and XPS studies of VUV/O<inf>3</inf> treated aromatic polyurea for high-speed electrophoresis microchips

NEXAFS and XPS studies of VUV/O<inf>3</inf> treated aromatic polyurea for high-speed electrophoresis microchips

Removed organic solderability preservative (OSPs) by Ar/O<inf>2</inf> microwave plasma to improve solder joint in thermal compression flip chip bonding

PES fabric plasma modification

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