2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) 2017
DOI: 10.1109/nordpac.2017.7993182
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Ag sinter joining and wiring for high power electronics

Katsuaki Suganuma
1
,
Norio Asatani
2
,
Kenta Kimoto
3
et al.
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