Ag and Cu metal-assisted chemical etching for diamond-wire-sawn single-crystalline silicon solar cell

Metal-assisted chemical etching beyond Si: applications to III–V compounds and wide-bandgap semiconductors

“…The wafer was patterned by nanosphere lithography and electroless wet Ag deposition formed the catalytic mask to etch pillars 35 nm high. Cu was also explored as catalyst, but unlike recent work where Cu was employed as a viable catalyst, 81,82 reference number, Temp.…”

“…The wafer was patterned by nanosphere lithography and electroless wet Ag deposition formed the catalytic mask to etch pillars 35 nm high. Cu was also explored as catalyst, but unlike recent work where Cu was employed as a viable catalyst, 81,82 Yasukawa et al found no catalytic effect of Cu and observed only conventional, acatalytic wet etching. Etching was found to proceed faster in the 〈100〉 direction by comparison with the 〈111〉.…”

Maskless patterning of metal nanoparticles and silicon nanostructures by a droplet deposition and etching process

“…As a solution, researchers have proposed the use of simple processes such as electroless plating 16 or the metal-assisted chemical etching (MACE) 17 process to create metal nanoparticles or silicon nanostructures. Owing to their straightforward and efficient fabrication setups that don't necessitate the preparation and setup of a galvanic etching cell to generate nanostructured silicon surfaces, 18 both electroless plating and MACE have emerged as appealing methods for nanoparticle deposition 16 or silicon nanostructure fabrication in various fields including micro-electrical mechanical systems, 19,20 biosensors, 21,22 solar cells, 23,24 energy storage, 25,26 mass spectrometry, 27,28 etc.…”