2003
DOI: 10.1016/s0169-4332(02)00695-5
|View full text |Cite
|
Sign up to set email alerts
|

Adventures in molecular electronics: how to attach wires to molecules

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

5
111
0

Year Published

2007
2007
2021
2021

Publication Types

Select...
5
2

Relationship

0
7

Authors

Journals

citations
Cited by 78 publications
(117 citation statements)
references
References 7 publications
5
111
0
Order By: Relevance
“…Early devices utilized vapor-deposited titanium as an adhesion layer for further metal deposition, in part to form a Ti-C bond which prevented penetration of metals into the monolayer. [14,59,123] Later work reported that Ti reacts with a SAM [124] or L-B film, [125] with possibly severe structural changes. In addition, Ti can oxidize during deposition, resulting in a molecule/TiOx/Ti (TiOx ¼ titanium oxide) structure with different properties from that of a molecule/metal device.…”
Section: Progress With Ensemble Molecular Junctionsmentioning
confidence: 99%
See 1 more Smart Citation
“…Early devices utilized vapor-deposited titanium as an adhesion layer for further metal deposition, in part to form a Ti-C bond which prevented penetration of metals into the monolayer. [14,59,123] Later work reported that Ti reacts with a SAM [124] or L-B film, [125] with possibly severe structural changes. In addition, Ti can oxidize during deposition, resulting in a molecule/TiOx/Ti (TiOx ¼ titanium oxide) structure with different properties from that of a molecule/metal device.…”
Section: Progress With Ensemble Molecular Junctionsmentioning
confidence: 99%
“…[6,49] A detailed study of metal deposition on SAMs revealed that penetration channels were formed through lateral motion of the thiolate molecules such that after deposition, the vapor-deposited metal was observed to be located on the substrate, with thiolate molecules re-adsorbing on top of the deposited metal. [124,130,131] Unfortunately, the same lateral restructuring of a thiolate SAM that permits a high degree of ordering to be obtained during assembly also permits metal penetration and causes relatively low thermal stability. Au readily penetrates L-B structures as well, although a soft deposition technique involving a cooled sample and an Ar backpressure to thermalize evaporated atoms has proven successful for Au, [132][133][134] Pb, and Al top contacts.…”
Section: Progress With Ensemble Molecular Junctionsmentioning
confidence: 99%
“…For instance, migration of metal atoms from the surface of one electrode to the second electrode may result in a highly conductive pathway (or filament) between the electrodes through which electrons can travel (Haynie et al 2003). In the case of SAMs of n-alkanethiolates, step edges and grain boundaries in the metal surface probably result in 'thin areas' of the SAM, where the molecules are not trans-extended and the top electrode contacts a disordered region of the SAM; this type of defect may result in a reduced length of the through-bond pathway between the electrodes and increased current (compared with that through the all-trans molecules).…”
Section: Reproducibility Of Measurements Of Charge Transportmentioning
confidence: 99%
“…The electrical transport through self-assembled monolayers of alkanedithiols was studied in large-area molecular junctions and described by the Simmons model [ [7][8][9] and theoretically (10)(11)(12)(13)(14)(15). Theoretical descriptions of electrical transport through molecular wires show that contacts, coupling of contacts to molecules, interface geometries, and vibrations are important in single-molecule experiments (16)(17)(18)(19)(20)(21).…”
mentioning
confidence: 99%