Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDL

Weyers, David; Nieweglowski, Krszystof; Bock, Karlheinz

doi:10.1109/estc55720.2022.9939517

Cited by 2 publications

(3 citation statements)

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“…We previously demonstrated light transmission across two µ-mirrors and a WG inside the optical BEOL [12]. However patterning quality was not ideal, thus this chapter will focus on upgrades to the individual steps of hybrid lithography process to improve structure quality, thus bare silicon is used as a substrate.…”

Section: Processingmentioning

confidence: 99%

“…In [10]- [12] we improved our UV-lithographic direct patterning of WGs from multi to single mode dimensions. With the reduction in layer height and feature size the formation of an inhibition layer of µ with the used 5 m ORMOCER®-material system demanded inert atmosphere during exposure.…”

Section: A Uv-lithographymentioning

confidence: 99%

“…Main focus of the process development is to improve patterning quality by working on the exposure. In [12] we explained, that our i-line Hg-lamp non-ideal, since it has to be moved away from its dedicated operation point to reduce lamp power, so that needed doses of a few mJ cm −2 can be delivered at reliable shutter times . Nevertheless we > .…”

Section: A Uv-lithographymentioning

confidence: 99%

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Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling

Weyers,

Nieweglowski,

Bock

2024

IMAPSource Proceedings

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This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution layer (RDL) and 2-photon- polymerization direct-laserwriting (2PP-DLW) for micro-mirrors inside RDL-opening. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV- ithography and need for broadband UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.

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Section: Processingmentioning

confidence: 99%

Section: A Uv-lithographymentioning

confidence: 99%

Section: A Uv-lithographymentioning

confidence: 99%

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