Advances in thermal laser separation: process monitoring in a kerf-free laser-based cutting technology to ensure high yield

Barreto, Mercedes Cerezuela; Roeder, G.; Steinhoff, Maximilian; Schellenberger, Martin; Bauer, Anton J.

doi:10.1016/j.procir.2018.08.056

Cited by 9 publications

(1 citation statement)

References 2 publications

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“…Three types of DBG processes were employed to compare the die strengths of the bare Si dies [8][9][10][11][12][13]. We investigated die strength for three dicing processes: blade dicing before grinding (BDBG), stealth dicing before grinding (SDBG), and plasma dicing before grinding (PDBG).…”

Section: Methodsmentioning

confidence: 99%

Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages

Kim,

Park,

Kim

et al. 2023

Micro and Nano Syst Lett

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The demand for advanced packaging is driven by the need for low-profile, densely-integrated, large-die Si devices in substrate-based or wafer-level packaging. Die strength is a critical parameter for ultrathin dies, making die singulation a vital aspect of advanced packaging technology. In this work, we present a dicing before grinding (DBG) process to compare and analyze die strengths using a mechanical blade, stealth laser, and plasma dicing. The three DBG processes were applied to a 200 mm silicon (Si) wafer process with a die size of 10 × 10 mm2 and thicknesses of 100, 200, and 300 μm, respectively. Optical and electron microscopes were employed to investigate chipping quality, sidewall damage, and surface contamination. The bare Si die’s strength was assessed using a three-point bending test. Plasma dicing before grinding (PDBG) resulted in less contamination, chipping, and cracking compared to other DBG processes. Furthermore, PDBG exhibited the highest die strength of 1052 Pa.

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Section: Methodsmentioning

confidence: 99%

Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages

Kim,

Park,

Kim

et al. 2023

Micro and Nano Syst Lett

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Influence of laser condition on the electrical and mechanical performance of bifacial half‐cutting PERC solar cell and module

Zhang

Shen

Liu³

et al. 2022

Intl J of Energy Research

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Summary In recent years, the laser half‐cutting technology for silicon solar cells has gotten much attention from researchers for increasing module power and would become particularly important in the photovoltaic modules domain. Herein, this paper would introduce a kind of new laser cutting process, a thermal laser separation (TLS) cutting technology. In the laser cutting processes, the influence on mechanical and electrical characteristics of bifacial p‐type passivated emitter and rear (PERC) solar cell and module were investigated in considerable detail. We have made a series of research and analyses including the cutting principle, opening length, fracture surface, and hot influence zone. The results reveal that the TLS cutting process could reduce damage more than the regular laser scribing and cleaving (LSC) cutting process. The TLS cutting process would achieve the higher power of a PERC half‐cutting bifacial module and the stronger bending strength of half solar cells than the LSC cutting process.

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Analysis of different laser cutting conditions on electrical characteristics of half-cut HJT solar cells

Otgongerel,

Moon,

Jun

et al. 2023

J. Korean Phys. Soc.

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Advances in thermal laser separation: process monitoring in a kerf-free laser-based cutting technology to ensure high yield

Cited by 9 publications

References 2 publications

Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages

Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages

Influence of laser condition on the electrical and mechanical performance of bifacial half‐cutting PERC solar cell and module

Analysis of different laser cutting conditions on electrical characteristics of half-cut HJT solar cells

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