2023
DOI: 10.1039/d2na00669c
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Advances in micro and nanoengineered surfaces for enhancing boiling and condensation heat transfer: a review

Abstract: This review highlights recent developments in improving thermal-hydraulic performance through two phase heat transfer facilitated by microstructured and nanostructured surfaces.

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Cited by 21 publications
(5 citation statements)
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“…The increased nucleation site density on the speleothem-inspired Cu/Ni surfaces enabled the premature initiation of bubble formation, leading to the observed improvements in critical heat flux (CHF) and the shift in the onset of nucleate boiling (ONB) toward lower temperatures. The relationship between delayed onset of nucleate boiling (ONB) and lower critical heat fluxes (CHFs) is commonly documented for surfaces with low wetting properties and those that are polished. , The HTC versus heat flux plots in Figure b indicate a slight decrease in HTC as heat flux approaches CHF for sintered Cu and Cu/Ni surfaces compared to plain copper. This behavior is ascribed to the increased thermal resistance encountered by the heat flux as it traverses the solid fraction of the particle matrix and speleothem-inspired wicked structures.…”
Section: Resultsmentioning
confidence: 99%
“…The increased nucleation site density on the speleothem-inspired Cu/Ni surfaces enabled the premature initiation of bubble formation, leading to the observed improvements in critical heat flux (CHF) and the shift in the onset of nucleate boiling (ONB) toward lower temperatures. The relationship between delayed onset of nucleate boiling (ONB) and lower critical heat fluxes (CHFs) is commonly documented for surfaces with low wetting properties and those that are polished. , The HTC versus heat flux plots in Figure b indicate a slight decrease in HTC as heat flux approaches CHF for sintered Cu and Cu/Ni surfaces compared to plain copper. This behavior is ascribed to the increased thermal resistance encountered by the heat flux as it traverses the solid fraction of the particle matrix and speleothem-inspired wicked structures.…”
Section: Resultsmentioning
confidence: 99%
“…The presence of the lubricating liquid on the surface also enables evaporation in the Cassie-Baxter mode, which improves the efficiency of heat transfer and reduces the formation of bubbles or hot spots. 120,121 This makes SLIPS a promising material for use in cooling systems, such as in power plants or electronic devices. 122 Assembly patterns after complete drying on a liquid substrate An ordered particulate monolayer is created through the evaporation of colloidal droplets situated at the liquid-air interface on liquid substrates and the deposition of central bumps at the liquid-liquid interface.…”
Section: Morphology Evolution Of Droplets On a Liquid Substratementioning
confidence: 99%
“…The lubricating liquid creates a low‐energy interface that is responsible for the unique properties of the surface, including its repellent behavior toward various substances. The presence of the lubricating liquid on the surface also enables evaporation in the Cassie–Baxter mode, which improves the efficiency of heat transfer and reduces the formation of bubbles or hot spots 120,121 . This makes SLIPS a promising material for use in cooling systems, such as in power plants or electronic devices 122 …”
Section: Materials Assembly Patterns and Morphology Evolutionsmentioning
confidence: 99%
“…[6][7][8] This ubiquitous boiling process has been an economical, attractive and efficient technology for energy utilization, and has found immense use in practical industrial applications, such as power plants, 9 heat exchangers, 10 nuclear reactors, 11 concentrated photovoltaics, 12 and high-power-density electronic device cooling. 13 The overall boiling process consists of the convection, nucleate boiling, transition and lm boiling, [14][15][16][17][18][19] and two key parameters including critical heat ux (CHF) and heat transfer coefficient (HTC) reect the boiling heat transfer capacity. [20][21][22][23][24][25] The CHF expresses the maximum heat ux that a boiling surface can withstand, whereas the HTC describes the capability of heat dissipation.…”
Section: Introductionmentioning
confidence: 99%
“…The overall boiling process consists of the convection, nucleate boiling, transition and film boiling, 14–19 and two key parameters including critical heat flux (CHF) and heat transfer coefficient (HTC) reflect the boiling heat transfer capacity. 20–25 The CHF expresses the maximum heat flux that a boiling surface can withstand, whereas the HTC describes the capability of heat dissipation.…”
Section: Introductionmentioning
confidence: 99%