Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

Liu, Fuhan; Zhang, Rui; DeProspo, Bartlet; Dwarakanath, Shreya; Nimbalkar, Pratik; Ravichandran, Siddharth; Weyers, David; Kathaperumal, Mohanalingam; Tummala, Rao; Swaminathan, Madhavan

doi:10.1109/ectc32862.2020.00182

Cited by 19 publications

(2 citation statements)

References 12 publications

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“…BEOL RDLs, however, suffer from the disadvantage of higher cost due to smaller wafer-size processing. With recent advances in glass interposers, this issue has now been addressed by providing a panel-sized solution, thus lowering the cost of high-density substrates [13,14]. Additionally, panel-scale processing is critical for the manufacturing of large body-size interposers and substrates, which are less economical at the wafer scale.…”

Section: Fabrication and Processingmentioning

confidence: 99%

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

Nimbalkar,

Bhaskar,

Kathaperumal

et al. 2023

Polymers

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The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies. There are several limitations to current generation technologies, and dielectric buildup layers are a key part of addressing those issues. Although there are several polymer dielectrics available commercially, there are numerous challenges associated with incorporating them into interposers or package substrates. This article reviewed the properties of polymer dielectric materials currently available, their properties, and the challenges associated with their fabrication, electrical performance, mechanical reliability, and electrical reliability. The current state-of-the-art is discussed, and guidelines are provided for polymer dielectrics for the next-generation interposers.

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Section: Fabrication and Processingmentioning

confidence: 99%

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

Nimbalkar,

Bhaskar,

Kathaperumal

et al. 2023

Polymers

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“…A wide variety of dielectric materials are studied to meet requirements for desired electrical performance of digital microsystem [ 6 ]. Among them, polyimide is the most widely applied.…”

Section: Introductionmentioning

confidence: 99%

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

et al. 2022

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High-speed digital microsystems has emerged as one of the most important solutions for improving system performance, bandwidth, and power consumption. Based on mature micro-system processing technology, a material extraction approach for silicon interposer applied for high-speed digital microsystems was presented in order to obtain frequency-dependent precise material parameters. By combining microwave theory and mathematical model of iterative algorithm, the dielectric constant (Dk) and the dissipation factor (Df) of polyimide dielectric layer is acquired, which minimizes testing costs and streamlines testing process. The method is based on two-port transmission/reflection measurements. Vector Network Analyzer (VNA) is used to extract the scattering parameters with an extraction range of 1 MHz to 10 GHz. The algorithm is programmed using MATLAB. The observed Dk values at 2 GHz, 6 GHz, 8 GHz, and 10 GHz are, respectively, 3.22, 3.04, 2.96, 3.03, and 2.91, while the corresponding Df values are 0.021, 0.025, 0.026, 0.026, and 0.024. Finally, the complex permittivity derived is simulated and analyzed using Ansys HFSS. The results verify the validity of the theoretical method and proves that the values of the complex permittivity obtained by the method in this paper are reliable.

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Packaging Materials in High-Performance Computing Applications

et al. 2022

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Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

Cited by 19 publications

References 12 publications

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

Packaging Materials in High-Performance Computing Applications

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