Advances in Flexible Hybrid Electronics Reliability

Leber, Darrell E.; Chaney, Richard L.; Hackler, D.; Meek, Brian N.; Leija, Seth D.; DeGregorio, K.; Wald, Steven F.; Wilson, Dale G.

doi:10.1109/wmed.2017.7916924

Cited by 7 publications

(4 citation statements)

References 1 publication

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“…The reliability theme is continued by the work of Hackler et al [49] supported by the US FlexTech consortium [50] who discuss the need for reliability qualification standards for printed electronics that differ from the traditional JECEC and MIL standards used for conventional electronics reliability assessment. Sitaraman et al [51] assess the mechanical and electrical behaviour of the printed silver conductor under the adaptive curvature flexure test.…”

Section: Reviewmentioning

confidence: 99%

Comparative Reliability of Inkjet-Printed Electronics Packaging

Tilford

Stoyanov

Braun

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper compares the thermomechanical behavior of 3D inkjet printed microelectronics devices relative to those fabricated from traditional methods. It discusses the benefits and challenges in the adoption of additive manufacturing methods for microelectronics manufacture relative to conventional approaches. The critical issues related to the design and reliability of additively manufactured parts and systems stem from the change in the manufacturing process and the change in materials utilized. This study uses numerical modelling techniques to gain insight into these issues. This article is an extension of a paper on the same topic presented at the 2018 IEEE Electronics Packaging Technology Conference [1]An introduction providing an overview of the area, covering salient academic research activities and discussing progress towards commercialization is presented. The state-of-the-art modular microelectronics fabrication system developed within the EU NextFactory project is introduced. This system has been used to manufacture several test samples, which were assessed both experimentally and numerically. A full series of JEDEC tests showed that the samples were reliable, successfully passing all tests.The numerical model assessing the mechanical behavior of an inkjet-printed structure during layer-by-layer fabrication is presented. This analysis predicts that the stresses induced by the UV cure process are concentrated toward the extremities of the part and, in particular, in the lower layers which are constrained by the print platform.Subsequently, a model of a multilayer microelectronics structure undergoing JEDEC thermal cycling is presented. The model assesses the differences in mechanical properties between a conventional FR4/copper structure and an inkjet-printed acrylic/silver structure. The model identified that the influence of the sintering process on subsequent material properties, behavior of the inject-printed structure, and reliability of the inject-printed structure is significant.Key findings are that while stresses in the conventional and inkjet boards are relatively similar, the inkjet-printed board exhibits significantly greater deformation than the standard board. Furthermore, the mechanical stresses in the inkjet fabricated board are strongly dependent on the elastic modulus of the sintered silver material, which, in turn, is dependent on the sintering process.

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Section: Reviewmentioning

confidence: 99%

Comparative Reliability of Inkjet-Printed Electronics Packaging

Tilford

Stoyanov

Braun

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Although, there is no standard bending test for the solar cells, the commonly used bending tests give an indication of the stability of the substrates and the thin films deposited on top of them. In flexible hybrid electronic industry, the ASTM D522M is a standard to test the organic coatings onto the flexible substrates (Hackler et al 2017). However, in the PV community researchers commonly use different bending radius and number of cycles to demonstrate the stability of their flexible solar cells.…”

Section: Stability Aspects Of Flexible Dscs and Pscsmentioning

confidence: 99%

Application of dye-sensitized and perovskite solar cells on flexible substrates

Lund¹,

Halme²,

Hashmi³

et al. 2018

Flex. Print. Electron.

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In this paper, a review of applying dye-sensitized (DSC) and perovskite solar cells (PSC) on flexible substrates is presented. Metallic and polymeric materials are the most common flexible substrates used. Cell integration into a textile substrate is also considered here as a future alternative. Common challenges with these include penetration of humidity, cell stability, and lifetime. Flexible DSC and PSC solar cells are still a niche technology, but have an inherent potential for cheap roll-to-roll massproduction of photovoltaics.

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“…[2][3][4] To avoid the performance degradation of IC (integrated circuit) attached to the tops of flexible substrates, the Si dies must possess a certain critical die thickness. However, larger die thicknesses not only compromise the flexibility (or bending radius) of the FHE itself, but also cause die detachment and interconnection delamination issues, 5,6) as shown in Fig. 1(a), and this is highly detrimental to the very concept of FHE.…”

Section: Introductionmentioning

confidence: 99%

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

Murugesan

Susumago

Sumitani

et al. 2021

Jpn. J. Appl. Phys.

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Au redistribution layers 10 to 100 μm wide were fabricated on heterogeneously integrated advanced flexible hybrid electronics (FHE) substrates formed by a die-first approach based on fan-out wafer-level packaging. The formed Au metal wiring was meticulously studied for locally induced mechanical stress upon bending (bending radius, BR 20 mm) using Laue microdiffraction (LμD) with synchrotron radiation. It was inferred from the LμD data that upon bending the FHE substrate up to the BR of 20 mm, the Au metal wiring (10 mm long, 100 μm wide, and 500 nm thick) experienced mechanical bending stress amounting to 250 ∼ 300 MPa. The stress values obtained from the LμD studies were close to the stress value of 350 MPa obtained by simulation.

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Advances in Flexible Hybrid Electronics Reliability

Cited by 7 publications

References 1 publication

Comparative Reliability of Inkjet-Printed Electronics Packaging

Comparative Reliability of Inkjet-Printed Electronics Packaging

Application of dye-sensitized and perovskite solar cells on flexible substrates

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics

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