Advances in Electronics Cooling

Marcinichen, Jackson B.; Olivier, Jonathan; Lamaison, Nicolas; Thome, John R.

doi:10.1080/01457632.2012.721316

Cited by 44 publications

(12 citation statements)

References 16 publications

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“…The use of such heat exchangers could result in enormous energy savings. For instance, the energy consumption of large data centres in the USA in 2010 was estimated to be 82 billion kWh that is about 2% of the total electricity production [20]. The potential for an increase of energy efficiency in these centres by use of boiling based removal of hardware generated heat is evident when one takes into account that currently non-efficient chilled air cooling technique consumes half of the aforementioned electricity amount [21].…”

Section: Urgency For More Accurate Modelling Of Boiling Heat Transfermentioning

confidence: 99%

Boiling heat transfer modelling: A review and future prospectus

Ilić¹,

Petrović

Stevanović

2019

THERM SCI

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This paper reviews the current status of boiling heat transfer modelling, discusses the need for its improvement due to unresolved intriguing experimental findings and emergence of novel technical applications and outlines the directions for an advanced modelling approach. The state-of-the-art of computational boiling heat transfer studies is given for: macro-scale boiling models applied in two-fluid liquid-vapour interpenetrating media approach, micro-, meso-scale boiling computations by interface capturing methods, and nano-scale boiling simulations by molecular dynamics tools. Advantages, limitations and shortcomings of each approach, which originate from its grounding formulations, are discussed and illustrated on results obtained by the boiling model developed in our research group. Based on these issues, we stress the importance of adaptation of a multi-scale approach for development of an advanced boiling predictive methodology. A general road-map is outlined for achieving this challenging goal, which should include: improvement of existing methods for computation of boiling on different scales and development of conceptually new algorithms for linking of individual scale methods. As dramatically different time steps of integration for different boiling scales hinder the application of full multi-scale methodology on boiling problems of practical significance, we emphasise the importance of development of another algorithm for the determination of sub-domains within a macro-scale boiling region, which are relevant for conductance of small-scale simulations.

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Section: Urgency For More Accurate Modelling Of Boiling Heat Transfermentioning

confidence: 99%

Boiling heat transfer modelling: A review and future prospectus

Ilić¹,

Petrović

Stevanović

2019

THERM SCI

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“…With the fact that flow boiling heat transfer coefficient is much higher than that of single phase flow, more energy saving can be achieved with boiling in microchannels. Marcinichen et al [25] conducted an evaluation study for three cooling systems to cool a server blade with total power 3.7 kW. The first system was single phase water cooling, the second system was two phase pumped loop cooling system using R134a and R1234ze and the third system was vapour compression cycle (VCC).…”

Section: Cost Effectiveness Of Using Two-phase Flow Pumped Systemsmentioning

confidence: 99%

Flow Boiling in Micro-Passages: Developments in Fundamental Aspects and Applications

Karayiannis

Mahmoud

2018

International Heat Transfer Conference 16

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Flow boiling in mini to micro passages located at the heat source, and as part of a thermal management system, has been identified as a possible way to remove the increasing high heat fluxes generated by high power electronic devices due to their capability of high heat transfer rates with small surface temperature variations. However, some still unresolved fundamental issues hinder the possible full adoption of this technology. These relate to the prevailing flow patterns, heat transfer rates and pressure drop in such geometries, and their dependence on key parameters. The possible major applications of flow boiling in microchannels are first mentioned in this paper, highlighting the requirements and the challenges of the thermal management of each application. The paper then presents new experimental research by the present authors as well as research reported in the literature on flow boiling in single tubes and rectangular multi microchannels to help elucidate the following fundamental issues: the definition of a microchannel, prevailing flow patterns, heat transfer mechanisms, flow instability and reversal and their effect on heat transfer rates, effect of channel material and surface characteristics (including latest research in coatings), effect of different fluid properties, and its relation to channel material, effect of channel length and aspect ratio. An appreciation of the above can help explain the interpretation of the prevailing fluid flow and heat transfer phenomena and the data scatter and discrepancies observed in past studies. In addition, models and correlations predicting flow patterns and heat transfer rates are presented.

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“…Moreover, emerging developed semiconductor devices such as Radio Frequency (RF) systems, high power Light-Emitting Diodes (LEDs), solar cells and solid-state laser light sources have all suffered large on-chip temperature gradients due to localized high heat flux resulting from the substantial non-uniformity in power dissipation [1][2][3][4][5][6]. To solve the heat problems, which include but are not limited to electronic systems, Marcinichen et al [7,8] suggested primarily four competing technologies for the cooling of chips: microchannel single-phase flow, porous media flow, jet impingement cooling, and microchannel two-phase flow. These technologies can be categorized into two types: passive and active cooling.…”

Section: Introductionmentioning

confidence: 99%