A review of small heat pipes for electronics

Chen, Xianping; Ye, Huaiyu; Fan, Xuejun; Ren, Tian‐Ling; Zhang, Guoqi

doi:10.1016/j.applthermaleng.2015.11.048

Cited by 241 publications

(62 citation statements)

References 136 publications

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“…The growing demand for the substitution of metals in those applications where heat exchange coupled with corrosion resistance, ease of process and low cost are required, pushed research on polymer composites and nanocomposites [1][2][3][4][5]. Here, the addition of proper fillers leads to the obtainment of thermally conductive materials, despite pristine polymers behave as heat insulators.…”

Section: Introductionmentioning

confidence: 99%

Effect of processing conditions on the thermal and electrical conductivity of poly (butylene terephthalate) nanocomposites prepared via ring-opening polymerization

et al. 2017

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Successful preparation of polymer nanocomposites, exploiting graphene-related materials, via melt mixing technology requires precise design, optimization and control of processing. In the present work, the effect of different processing parameters during the preparation of poly (butylene terephthalate) nanocomposites, through ring-opening polymerization of cyclic butylene terephthalate in presence of graphite nanoplatelets (GNP), was thoroughly addressed. Processing temperature (240°C or 260°C), extrusion time (5 or 10 minutes) and shear rate (50 or 100 rpm) were varied by means of a full factorial design of experiment approach, leading to the preparation of polybutylene terephthalate/GNP nanocomposite in 8 different processing conditions. Morphology and quality of GNP were investigated by means of electron microscopy, X-ray photoelectron spectroscopy, thermogravimetry and Raman spectroscopy. Molecular weight of the polymer matrix in nanocomposites and nanoflake dispersion were experimentally determined as a function of the different processing conditions. The effect of transformation parameters on electrical and thermal properties was studied by means of electrical and thermal conductivity measurement. Heat and charge transport performance evidenced a clear correlation with the dispersion and fragmentation of the GNP nanoflakes; in particular, gentle processing conditions (low shear rate, short mixing time) turned out to be the most favourable condition to obtain high conductivity values. . This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ ©2017. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ higher thermal conductivity [28,29]. In a recent paper, we demonstrated that the addition of hightemperature-annealed rGO in a polymer matrix leads to a thermal conductivity which is about 2-fold those of poly (butylene terephthalate) containing pristine rGO (higher defectiveness) or GNP [30], further confirming the need of high quality nanoflakes for the preparation of highly thermally conductive polymer nanocomposites. On the other hand, the control of GRM organization into a polymer matrix remains crucial in terms of nanoparticle distribution and quality of contacts between particles. Attempts in precisely controlling orientation and contacts between nanoparticles indeed resulted in an improvement of thermal transfer [31-33] but the methods adopted for the preparation of these nanocomposites are hardly up-scalable or requires very high filler concentrations. Finally, the reduction of interfacial thermal resistance was also pursued by nanoparticle functionalization [34][35][36], despite the effectiveness of this strategy may be also related to the lateral size of the nanoflakes [37]. Recently, the preparation of polymer nanocomposites was obtained by in-situ ring-opening polymerization of cyclic butylene terephthalate (CBT) oligomers into poly (butylene terephthalate), ...

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Section: Introductionmentioning

confidence: 99%

Effect of processing conditions on the thermal and electrical conductivity of poly (butylene terephthalate) nanocomposites prepared via ring-opening polymerization

et al. 2017

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“…The performance of heat pipes and vapor chambers is limited by their size and device dimensions [5]. They are preferred where device compactness is desired and the condensing surfaces can be placed in close proximity of the evaporator surface.…”

Section: Introductionmentioning

confidence: 99%

A thermosiphon loop for high heat flux removal using flow boiling of ethanol in OMM with taper

Panse

Kandlikar

2017

International Journal of Heat and Mass Transfer

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“…Loop heat pipes (LHP) are widely used for thermal management and cooling in electronics [1][2][3] because of their high capacity to transmit heat over long distances with only small drops in temperature. The primary wick [4] is central to these devices, because it provides the necessary capillary force to pump the working fluid around the device from the heat source to the heat sink [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…The capillary pumping should be sufficient to ensure the correct supply of fluid to the LHP evaporation zone, preventing any dry spots from appearing at the wick's liquid-vapor interface, which means that liquid velocity through the wick (ṁ ) must be larger than the liquid evaporation rate at the liquid-vapor interface (ṁ C ) [20]. ṁ ≥ ṁ C (1) It is known that the Washburn equation determines the capacity of capillary pumping or pumping height (y) of a bundle of parallel cylindrical tubes as a function of time (t) and some fluid properties (surface tension (σ), contact angle (ϕ), viscosity (µ)), and the tube radius (reff).…”

Section: Introductionmentioning

confidence: 99%

Performance Assessment of a Three-Dimensional Printed Porous Media Produced by Selective Laser Melting Technology for the Optimization of Loop Heat Pipe Wicks

Esarte¹,

Ilzarbe

Bernardini³

et al. 2019

Applied Sciences

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The primary wick in a loop heat pipe device is a key component that is central to the operation of the device. Both high permeability and capillary pumping capacity, two properties highly dependent on wick structure, are strongly desirable for a satisfactory thermal performance. In this paper, selective laser melting (SLM), a three-dimensional (3D) printing technology, is used to create a primary wick for an 80 W heat transfer application. The permeability and capillarity values of this wick, experimentally measured, are compared with those built with the most widely used technologies nowadays, such as powder sintering and meshes. In this study, the SLM scaffold is shown to satisfy the minimum values required by the application in terms of capillarity and permeability: 0.031 mm/s and 4 × 10−12 m2, respectively. Our comparative study revealed that the wick produced with the SLM technology presented higher values of permeability, by two orders of magnitude, and slightly higher capillary figures than those corresponding to powder sintering for such application. However, it had capillary values well below those of a stainless-steel mesh. The hydraulic behavior of the SLM wick was better than that of the sintered copper powder, because it not only met the above-mentioned specifications, but it also improved its performance.

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A review of small heat pipes for electronics

Cited by 241 publications

References 136 publications

Effect of processing conditions on the thermal and electrical conductivity of poly (butylene terephthalate) nanocomposites prepared via ring-opening polymerization

Effect of processing conditions on the thermal and electrical conductivity of poly (butylene terephthalate) nanocomposites prepared via ring-opening polymerization

A thermosiphon loop for high heat flux removal using flow boiling of ethanol in OMM with taper

Performance Assessment of a Three-Dimensional Printed Porous Media Produced by Selective Laser Melting Technology for the Optimization of Loop Heat Pipe Wicks

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