Advanced Three-Dimensional Microelectrode Architecture Design for High-Performance On-Chip Micro-Supercapacitors

Abstract

The rapid development of miniaturized electronic devices has greatly stimulated the endless pursuit of high-performance on-chip micro-supercapacitors (MSCs) delivering both high energy and power densities. To this end, an advanced three-dimensional (3D) microelectrode architecture design offers enormous opportunities due to high mass loading of active materials, large specific surface areas, fast ion diffusion kinetics, and short electron transport pathways. In this review, we summarize the recent advances in the rational design of 3D architectured microelectrodes including 3D dense microelectrodes, 3D nanoporous microelectrodes, and 3D macroporous microelectrodes. Furthermore, the emergent microfabrication strategies are discussed in detail in terms of charge storage mechanisms and structure− performance correlation for on-chip MSCs. Finally, we conclude with a perspective on future opportunities and challenges in this thriving field.

Constructing MXene hydrogels and aerogels for rechargeable supercapacitors and batteries

“…Electrochemical capacitors, also named supercapacitors, work through the principle of ion adsorption (electrochemical doublelayered capacitors) and surface redox/intercalation reaction (pseudo-capacitors). 51,99 The capacitors demonstrate a high power density but suffer from poor conductivity and low capacitance. MXenes with a unique 2D layered structure, high conductivity, abundant termination groups, and adjustable components have been regarded as potential electrodes for supercapacitors.…”

Planar micro-supercapacitors toward high performance energy storage devices: design, application and prospects

“…[1][2][3] In particular, wearable electronics, biomedical sensors and renewable energy grids can facilitate the miniaturization and integration of energy storage systems. 4,5 Lithium-ion batteries (LIBs) and supercapacitors (SCs) are commonly used as the energy storage components in different fields depending on their intrinsically high energy and power densities, respectively. However, the limited lifetime and power density of LIBs may restrain their widespread application for on-chip electronics as well as be a bottleneck in micro-sized and integrated systems.…”

From cotton to functional flexible transparent film for printable and flexible microsupercapacitor with strong bonding interface

“…16,[22][23][24][25] Researchers usually improve the adhesion force between electrode materials and plastic substrate by adding binders into the electrode materials. [26][27][28][29][30] However, the introduction of insulating binders inevitably sacrices the overall areal capacitance of the microsupercapacitor. The areal capacitance is critical for further utilization, especially for the limited footprint area on miniaturized and wearable devices.…”