Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Abstract

We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique hygroscopic behavior of polymeric materials used in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study corroborate that the advanced scheme can be used effectively for package assemblies subjected to general anisothermal loading conditions.

Novel Method to Evaluate Moisture Permeation of the Metal Barrier Coating on Polymer Substrate

“…16 There was no problem measuring the weight gain curve for a small sample with a partly curved surface. This result indicates that the WGT can be used to evaluate the water-vapor penetration for small and curved-shaped samples.…”

Analytical solutions of gas transport problems in inorganic/organic hybrid structures for gas barrier applications

“…The heat conduction analogy is extremely useful in practice; ͑1͒ the analytical solutions of various heat conduction problems exist, 12 and ͑2͒ the majority of commercial software packages does not offer mass diffusion modules but only heat conduction modules. 13 The analogy has been utilized extensively to address water diffusion inside semiconductor packages [13][14][15][16][17][18][19] and food. 20 It is extended in this study to derive the analytical solutions of gas diffusion problems in inorganic/organic hybrid structures.…”

Interface delamination analysis of TQFP package during solder reflow

“…Relative moisture distribution and overall moisture content can be obtained from the analytical solution for moisture absorption as follows [23][24][25][26]:…”