2013
DOI: 10.1007/978-1-4614-1963-1
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Advanced Thermal Management Materials

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Cited by 26 publications
(6 citation statements)
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“…In order to address this, there are several approaches including cryogenic coolers, fan-blown air cooling, heat sinks, and micropumps. [246,247] In this context, one effective technique is the application of thermal management materials such as high thermally conductive polymeric composites to provide efficient heat dissipation routes in microelectronic packaging. Considering their lightweight, processability, and low cost, they are promising materials for microelectronics packaging.…”
Section: Discussionmentioning
confidence: 99%
“…In order to address this, there are several approaches including cryogenic coolers, fan-blown air cooling, heat sinks, and micropumps. [246,247] In this context, one effective technique is the application of thermal management materials such as high thermally conductive polymeric composites to provide efficient heat dissipation routes in microelectronic packaging. Considering their lightweight, processability, and low cost, they are promising materials for microelectronics packaging.…”
Section: Discussionmentioning
confidence: 99%
“…Here again, the approach of a lumped analytic model is taken, with certain parameters determined through numerical methods, measurements and literature [9], [10]. This allows determining the temperatures at selected points, such as the coolant temperature at the outer perimeter of the machine or the temperature in the center point of the magnets.…”
Section: B Thermal Modelmentioning
confidence: 99%
“…Thermal management of microelectronics is unprecedentedly crucial due to the rapid miniaturization in semiconductor technology, as it is essential to achieving high compactness along with high performance and reliability [1][2][3][4] . With the application of electronic devices with higher power consumption in smaller packages, micro-/nanoscale thermal analysis is necessary to understand and predict the Joule-heating effect for the design and improvement of thermal packaging.…”
Section: Introductionmentioning
confidence: 99%