The 17th Annual SEMI/IEEE ASMC 2006 Conference
DOI: 10.1109/asmc.2006.1638718
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Advanced Process Monitoring and Control Methods for Poly Gate CD Targeting

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Cited by 4 publications
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“…Advanced process control (APC) systems improve the electrical performance of devices by reducing the random CD and profile variation induced during predominant process steps. Real-time control loops feed in-line CD and profile data to gate lithography, gate etch, and downstream processes (implant and anneal) to reduce Lef, variations and improve Leff targeting [6]. Figure 4 shows a 30% improvement in wafer mean gate CD variation due to metrology-driven APC improvements.…”
Section: Importance Of Metrologymentioning
confidence: 94%
“…Advanced process control (APC) systems improve the electrical performance of devices by reducing the random CD and profile variation induced during predominant process steps. Real-time control loops feed in-line CD and profile data to gate lithography, gate etch, and downstream processes (implant and anneal) to reduce Lef, variations and improve Leff targeting [6]. Figure 4 shows a 30% improvement in wafer mean gate CD variation due to metrology-driven APC improvements.…”
Section: Importance Of Metrologymentioning
confidence: 94%
“…APC systems improve the electrical performance of devices by reducing the random CD and profile variation induced during predominant process steps. Real-time control loops feed inline CD and profile data to gate lithography, gate etch, and downstream processes (implant and anneal) to reduce variations and improve targeting [6]. In fact, APC is a fundamentally new concept that gives metrology a key role in determining the quality of the final product.…”
Section: Advanced Process Control (Apc)mentioning
confidence: 99%