Advanced Power SiP with Wireless Bonding for Voltage Regulators

Hashimoto, Takayuki; Uno, T.; Satou, Yoshihisa; Shiraishi, Masaki; Kawashima, T.; Matsuura, N.

doi:10.1109/ispsd.2007.4294948

Cited by 17 publications

(3 citation statements)

References 5 publications

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“…For example, in the previous works, a Cu lead technology, the multi-chip module and the power module technologies achieved high speed and low noise switching characteristics by the reduction of the stray inductance. [24][25][26] In the future, for discrete power devices, the lead inductance in the package cannot be neglected. To avoid the self-turn-on operation, the gate surge voltage induced by the parasitic inductance must be suppressed less than the gate threshold voltage V th .…”

Section: Discussionmentioning

confidence: 99%

Power device trends for high-power density operation of power electronics system

Saito

2014

Jpn. J. Appl. Phys.

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Section: Discussionmentioning

confidence: 99%

Power device trends for high-power density operation of power electronics system

Saito

2014

Jpn. J. Appl. Phys.

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“…Thermal control is one most critical issue for both operating performance and long-term reliability thereof. To improve the packaging thermal efficiency, packages such as D2PAK, D-PAK, Power SOP and MLP are broadly accepted approaches [5][6][7][8]. In these packages, heat generated at the face of the die has to travel through the bulk of the silicon and through the heat sink to be finally dissipated through the printed circuit board and the ambient.…”

Section: Technology Analysismentioning

confidence: 99%

A cool packaging technology for power conversion application

Jin

2011

2011 IEEE International Conference on Computer Science and Automation Engineering

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Power management relieves critical bottlenecks in saving electrical energy and efficient switching devices are particularly required for synchronous power conversion module. To optimize both switching and thermal efficiencies for convertor configuration it relies on the advanced package technology. An analysis has been undertaken in this work to identify the challenge on power electronic packages to ensure the system efficiencies continue to increase. This paper presents an innovative three-dimension (3D) packaging technology -CoolPAK, which enables high voltage, high frequency and high reliable voltage switching with reduced power loss in thermal dissipation.

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“…Future MCM developments aim at continuing the reduction of the parasitic elements, in particular, the half-bridge loop inductance [221]- [224], adding further power saving functionality, such as the control modes for light load described in section 1.2.7.3, and implement advanced packaging with, for instance, embedded technologies [225], [226].…”

Section: Packaging and Integrationmentioning

confidence: 99%

Prospects of voltage regulators for next generation computer microprocessors

López Julià

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Synchronous buck converter based multiphase architectures are evaluated to determine whether or not the most widespread voltage regulator topology can meet the power delivery requirements of next generation computer microprocessors. According to the prognostications, the load current will rise to 200A along with the decrease of the supply voltage to 0.5V and staggering tight dynamic and static load line tolerances. In view of these demands, researchers face serious challenges to bring forth compliant solutions that can further offer acceptable conversion efficiencies and minimum mainboard area occupancy. Among the most prominent investigation fronts are those surveying fundamental technology improvements aiming at making power semiconductor devices more effective at high switching frequency. The latter is of critical importance as the increase of the switching frequency is fundamentally recognized as the way forward to enhance power density conversion. Provided that switching losses must be kept low to enable the miniaturization of the filter components, one primary goal is to cope with semiconductor and system integration technologies enabling fast dynamic operation of ultra-low ON resistance power switches. This justifies the main focus of this thesis work, centered around a comprehensive analysis of the MOSFET switching behavior in the synchronous buck converter. The MOSFETs dynamic operation, far from being well describable with the traditional clamped inductive hard-switching mode, is strongly influenced by a number of frequently ignored linear and nonlinear parasitic elements that must be taken into account in order to fully predict real switching waveforms, understand their dynamics, and most importantly, identify and quantify the related mechanisms leading to heat generation. This will be revealed from in-depth investigations of the switched converter under fast switching speeds and heavy load. Recognizing the key relevance of appropriate modeling tools that support this task, the second focal point of the thesis aims at developing a number of suitable models for the switching analysis of power MOSFETs. Combined with a series of design guidelines and optimization procedures, these models form the basis of a proposed methodological approach, where numerical computations replace the usually enormous experimental effort to elucidate the most effective pathways towards reducing power losses. This gives rise to the concept referred to as virtual design loop, which is successfully applied to the development of a new power MOSFET technology offering outstanding dynamic and static performance characteristics. From a system perspective, the limits of the power density conversion will be explored for this and other emerging technologies that promise to open up a new paradigm in power integration capabilities.

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Advanced Power SiP with Wireless Bonding for Voltage Regulators

Cited by 17 publications

References 5 publications

Power device trends for high-power density operation of power electronics system

Power device trends for high-power density operation of power electronics system

A cool packaging technology for power conversion application

Prospects of voltage regulators for next generation computer microprocessors

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