Advanced Packaging: The Redistributed Chip Package

Abstract

The Redistributed Chip Package (RCP) is a substrateless embedded chip package that offers a low-cost, high performance, integrated alternative to current wirebond BGA and flip chip BGA packaging. Devices are encapsulated into panels while routing of signals, power, and ground is built directly on the panel. The RCP panel and signal build-up lowers the cost of the package by eliminating wafer bumping and substrates thereby enabling large scale assembly in panel form. The build-up provides better routing capabilities and better integration. Also, by eliminating bumping, the device interconnect is inherently Pb-free, and the stress of the package is reduced enabling ultra-low K device compatibility. The panel is created by attaching device active side down to a substrate, encapsulating and curing the devices, grinding to desired thickness, and then removing the substrate. Signal, power, and ground planes are created using redistribution-like processing. Multi-layer metal RCP packages have passed -40 to 125C air-to-air thermal cycling and HAST after MSL3/260 preconditioning.

Propagation Behavior of Multilayer Microstrips Applied to Interconnects Running Near Embedded Integrated Components

“…Before this integral equation can be solved, a reasonable trial function has to be chosen. Yamashita [21] suggests that elsewhere (2) which is modeled after the electrostatic charge density on an infinitely thin conductor strip in free space and offers a good compromise between computing time and accuracy. The admittance parameter can be calculated using the transverse transmission-line method.…”

“…Two different categories of chip-embedding technologies can be discerned. Fan-out wafer-level packaging enlarges the area available for interconnect routing on top of the die by embedding the chip in a polymer matrix [1], [2]. More system-level approaches, such as the direct embedding of chips into the printed circuit board (PCB), result in a system-in-package concept.…”

A new methodology to measure electromagnetic interferences in 3G mobile platform

“…Indeed, in one year, an average decrease of 15% in weight, 15 % in PCB size, and 20% in cost has been observed whereas the increase in volume of units is close to 50% [1]. To achieve these goals, mobile phone designers use the latest technologies in terms of printed circuit boards, packages [2], [3 ] and chips [4]. They also associate very different devices, such as analog structures, numerical computing units and mid-range power modules in a single package.…”

Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology

“…In contrast, embedding chips into a substrate and connecting the chips using etching or drilling processes and subsequent metal plating processes, being a comparatively new technology, is still rarely used. One example of this technology is General Electric's "chipfirst" technology [8] for fabricating multi-chip modules or the redistributed chip package (RCP) technology [9]. The technology to embed chips into multilayer PCBs offers great opportunities for stacking active, passive and RF components and for reducing fabrication costs.…”