Advanced packaging automation for opto-electronic systems

Bhat, Shubham K.; Kurzweg, Timothy P.; Guez, A.

doi:10.1109/ltimc.2004.1370981

Cited by 1 publication

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References 11 publications

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“…If the refractive index of the epoxy is n m = 1.45, the difference of power coupling loss is described approximately as Eq. 36 and 37: Packaging experiments: In order to study effects of adhesive on the optical performance in practical photonic packaging, we used a fiber alignment system which designed by ourselves with sub-micron precision for the alignment of optical fibers to planar waveguides, The system was equipped with two six-axis nanopositioning stages and a power meter (Model 2835-C) from Newport (Bhat et al, 2004). On the two nanopositioning stages, we installed fiber-array holders.…”

Section: Fresnel Transmission Loss and Power Transmittancementioning

confidence: 99%

Effects of Adhesive on Coupling Efficiency of Planar Light Waveguide Packaging

Bo¹

2010

American Journal of Nanotechnology

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Problem statement: Advanced optoelectronic devices are a kind of key and basic components for next generation communication, untouched sensor, medical testing. They have lots of advantages including greater communication performance, larger capacity, and more fixable form. But light coupling and package structure seriously affects performance of optoelectronic devices. So a lot of attaching methods were proposed to package optoelectronic devices. A popular method which was widely used is a UV epoxy adhesive which can solidify the coupling interface with high mechanical strength and submicron displacement. In order to obtain high coupling efficiency, coupling approximation after adhesive is needed. Approach: In this study, firstly, the light coupling model was introduced. Then light beam propagation mode after adhesive with the same refractive index as that of light path was presented and the function modeling of couple model was derived. Finally, a slantedplane structure of interface was considered and coupling approximation after adhesive was calculated. Results: Simulations and experimental results indicate that theoretical coupling efficiency and measured coupling efficiency agree with very well and the couple loss decrease about 0.4dB after adhesive. Conclusion: The matching adhesive could obviously increase the coupling efficiency and the approximation function could realize to predict the variation of coupling efficiency before or after adhesive accurately.

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Section: Fresnel Transmission Loss and Power Transmittancementioning

confidence: 99%

Effects of Adhesive on Coupling Efficiency of Planar Light Waveguide Packaging

Bo¹

2010

American Journal of Nanotechnology

View full text Add to dashboard Cite

show abstract

Advanced packaging automation for opto-electronic systems

Cited by 1 publication

References 11 publications

Effects of Adhesive on Coupling Efficiency of Planar Light Waveguide Packaging

Effects of Adhesive on Coupling Efficiency of Planar Light Waveguide Packaging

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