Effects of Adhesive on Coupling Efficiency of Planar Light Waveguide Packaging

Abstract

Problem statement: Advanced optoelectronic devices are a kind of key and basic components for next generation communication, untouched sensor, medical testing. They have lots of advantages including greater communication performance, larger capacity, and more fixable form. But light coupling and package structure seriously affects performance of optoelectronic devices. So a lot of attaching methods were proposed to package optoelectronic devices. A popular method which was widely used is a UV epoxy adhesive which can solidify the coupling interface with high mechanical strength and submicron displacement. In order to obtain high coupling efficiency, coupling approximation after adhesive is needed. Approach: In this study, firstly, the light coupling model was introduced. Then light beam propagation mode after adhesive with the same refractive index as that of light path was presented and the function modeling of couple model was derived. Finally, a slantedplane structure of interface was considered and coupling approximation after adhesive was calculated. Results: Simulations and experimental results indicate that theoretical coupling efficiency and measured coupling efficiency agree with very well and the couple loss decrease about 0.4dB after adhesive. Conclusion: The matching adhesive could obviously increase the coupling efficiency and the approximation function could realize to predict the variation of coupling efficiency before or after adhesive accurately.

Effect of Doping Position on the Active Silicon-on-Insulator Micro-Ring Resonator Based on Free Carrier Injection

“…Photonic Integrated Circuits (PIC) is expected to grow rapidly in terms of its density and owing to these more concise optical components are required (Bo, 2011;Thylen et al, 2006). It has been proven lately that the Silicon-On-Insulator (SOI)-based optical micro-ring resonator is one of the most important components for more complex photonic integrated circuits due to its compactness (Xu et al, 2005).…”