Advanced MEMS-based technologies and displays

Ma, Jin

doi:10.1016/j.displa.2014.10.003

Cited by 38 publications

(20 citation statements)

References 39 publications

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“…However, having a single‐cell tunable‐color pixel design, which can generate all primary colors, is always desirable for high pixel density displays . An example of this is a single mirror interferometric (SMI) display, where a moving MEMS mirror is used to tune the pixel color in the visible spectrum . Having movable objects, however, has proven to be a major limitation of these devices in terms of durability, switching power consumption, and reliability in response to mechanical shocks in portable electronics.…”

Section: Introductionmentioning

confidence: 99%

A Reconfigurable Color Reflector by Selective Phase Change of GeTe in a Multilayer Structure

Jafari

Guo

Rais‐Zadeh

2019

Advanced Optical Materials

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It is shown that a phase change material (PCM), germanium telluride (GeTe), when integrated into a subwavelength layered optical cavity, can produce widely tunable reflective colors. It is shown that the crystallization temperature (Tx) of GeTe is dependent on the film thickness for thin films of less than ≈20 nm, which is exploited for color tuning. Four colors from the same physical structure are demonstrated by electrical heating, through novel optical and thermal engineering of a thin film stack that includes two GeTe layers with only a single integrated joule heater element. The selective sensitivity to incident light angle and low polarization dependence, as well as the low static power consumption of this device make it a good candidate for potential consumer electronics applications.

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Section: Introductionmentioning

confidence: 99%

A Reconfigurable Color Reflector by Selective Phase Change of GeTe in a Multilayer Structure

Jafari

Guo

Rais‐Zadeh

2019

Advanced Optical Materials

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“…Materials for microelectromechanical systems (MEMS) undergo rapid development, covering many properties and applications [1]. In that sense, stainless steel is a common material applied in different industries, with a wide application potential, due to its chemical resistance, high mechanical strength, good heat and electric conductivity, low cost and of course corrosion resistance.…”

Section: Introductionmentioning

confidence: 99%

Laser-Welded Steel Foils with Sapphire Substrates

Pablos-Martín

Große

Cismak

et al. 2016

Acta Metall. Sin. (Engl. Lett.)

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A nanosecond pulsed laser was used to weld stainless steel foils of 10 lm thickness to the sapphire substrates. The microstructure of the bonded interface was studied. Both materials were partially ablated under the influence of the laser beam. An inhomogeneous distribution of the steel and sapphire along the bonded interface is observed. The electrical resistance of the steel foil was measured before and after laser welding, showing that the weld slightly increases the electrical resistance but still keeps the values acceptable for electrical contacts

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“…Microfabrication is used to construct physical objects with dimensions in the micrometre to millimetrer ange [24].T his technologyh as very high precisioni nt he fabrication process and therefore,i ti ss uitable for preparing micro-electrodes [21] and is based on deposition, lithography and etching steps.M aterials like silicon, polymers, metals and silicon oxide or silicon nitride [ 25] that enable the fabrication of wells,r eactors,c hannels,a nd electrodes in variouss izes and geometries are used [22,26].M icrofabrication technology also enables batch-fabrication, which leads to production of inexpensive sensors and even, disposable,m aintenance-free sensors [27].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Characterization of the Microfabricated Electrochemical Sensor‐Array System

et al. 2016

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Microfabrication technology has been used to prepare a microchip sensor‐array with six sets of platinum electrodes. Chromium/platinum (10 nm/100 nm thick) were sputtered on a borosilicate wafer and patterned by wet etching method. The electrodes were designed with working electrode area of 700×400 μm in the middle and a 200 μm wide and 2600 μm long counter electrode surrounding it from three sides in a U‐shape. The connection pads (1000×1500 μm) were located at the edge of a sensor‐array chip. Silicon wafer was etched through to form holes with slanting side walls for immobilization cavities. The silicon and the borosilicate wafers were adhesion bonded with SU‐8 epoxy resin. The cyclic voltammetry and electrochemical impedance experiments were carried out in a three‐electrode electrochemical system to characterize the fabricated sensor‐array chip. The results show that the current density depends on the electrode potential sweep rate ν. Also, current density depends on the concentration of potassium hexacyanoferrate(III). At slow potential sweep rates (ν≤0.01 V s−1) the steady‐state signal is achieved and the electrodes behave as micro‐electrodes. Such an array is a promising candidate for fast and simple biochemical oxygen demand (BOD) measurements.

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Advanced MEMS-based technologies and displays

Cited by 38 publications

References 39 publications

A Reconfigurable Color Reflector by Selective Phase Change of GeTe in a Multilayer Structure

A Reconfigurable Color Reflector by Selective Phase Change of GeTe in a Multilayer Structure

Laser-Welded Steel Foils with Sapphire Substrates

Electrochemical Characterization of the Microfabricated Electrochemical Sensor‐Array System

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