Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique

Liu, Yanqiang; Fan, Jie; Hao, Xin-Xiang; Shao-hua, Wei; Nie, Junhui; Ma, Zili; Liu, Mingkun; Wang, Ya-Bao

doi:10.1007/s12598-016-0833-1

Cited by 11 publications

(3 citation statements)

References 10 publications

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“…These high-silicon-aluminum composites hold great potential for diverse applications in aviation, aerospace, and national defense [6,7]. The Sumitomo Electric Corporation in Japan utilized powder metallurgy hot extrusion to create an Al-40 wt.% Si composite with a CTE of 13 × 10 −6 •K −1 , TC of 126 W/(m•K), and density of 2.53 g/cm 3 [8]. Wang et al [9] successfully prepared an Al-70 wt.% Si composite through extrusion casting and hot-pressing sintering, resulting in a three-dimensional continuous network distribution of a reinforcing phase with a relatively dense microstructure and some defects.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ball Milling Time on the Microstructure and Properties of High-Silicon–Aluminum Composite

Kong,

Wang,

Chen

et al. 2023

Materials

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The duration of ball milling greatly influences the characteristics of high-silicon–aluminum composite during the ball milling process. This study examines how the microstructure, thermal conductivity, and hardness of a high-silicon–aluminum composite are affected by different ball milling times. We exposed the powder to various durations of ball milling and employed different pellet ratios. Following this treatment, the powder underwent consolidation via discharge plasma sintering. Our findings show that with a pellet ratio of 10:1 and a milling duration of 8 h, the powder particles were refined, resulting in a more uniform and dense material composition. This refined material boasted a thermal conductivity of 111.6 W/m·K, a Brinell hardness of 136.8 HBW, and a density of 2.304 g/cm3. This method facilitates the creation of a uniform composite powder composition. It encourages the development of a fine-grain structure, which enables the production of particle-reinforced composites with superior properties.

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Section: Introductionmentioning

confidence: 99%

Effect of Ball Milling Time on the Microstructure and Properties of High-Silicon–Aluminum Composite

Kong,

Wang,

Chen

et al. 2023

Materials

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“…Aluminum-high Silicon (Al-Si) alloy exhibits favorable TC, high specific strength and stiffness, good plating compatibility with gold, silver, copper, and nickel, weldability to substrates, and ease of precision machining [2,3]. Furthermore, it is readily available, environmentally benign, non-toxic, and easily recyclable [4][5][6]. This material is primarily employed in aerospace, space technology, portable electronic devices, and other high-tech domains.…”

Section: Introductionmentioning

confidence: 99%

Effect of sintering process on microstructure and properties of Al–Si alloy made by powder metallurgy for electronic packaging application

Kong,

Huang,

et al. 2023

Mater. Res. Express

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The effect of sintering temperature on the microstructure and properties of the Al-Si composite was investigated. Al-60Si (wt.%) composites were sintered at different temperatures. The samples showed the best microstructural properties when sintered at 850 °C for 2 h. The thermal conductivity, coefficient of thermal expansion, and relative density were equal to 131.4 W/(m·K), 10.02×10–6 K–1, and 99.87 %, respectively. An appropriate increase in the temperature effectively improved the wettability of the material, thereby, promoted the filling of holes inside the material by liquid Al. Moreover, reduction in the total number of interfaces inside the material and ensuring the formation of a connected network by the Al matrix enhanced the thermal conductivity and coefficient of thermal expansion of the material.

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“…The types of thin-film material deposited on Si substrates include polycrystalline Si, Si dioxides, Si nitrides, and aluminum (Al) [2]. Among these materials, Al-Si bi-materials have received much attention because of their exceptional material properties, in particular their low friction coefficient and wear rate [6,7], excellent strength-to-weight ratio and mechanical properties [8,9], low coefficient of thermal expansion, and excellent thermal conductivity [10,11]. Owing to these outstanding and useful properties, various types of research have been performed on the utilization of Al-Si bi-materials for MEMS and sensor structures.…”

Section: Introductionmentioning

confidence: 99%

Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems

Shim¹,

Go²,

Beom³

2021

Materials

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In this study, tensile tests on aluminum/silicon vertically cracked nanofilm/substrate systems were performed using atomistic simulations. Various crystallographic orientations and thicknesses of the aluminum nanofilms were considered to analyze the effects of these factors on the reliability of the nanofilm/substrate systems. The results show that systems with some specific crystallographic orientations have lower reliability compared to the other orientations because of the penetration of the vertical crack into the silicon substrate. This penetration phenomenon occurring in a specific model is related to a high coincidence of atomic matching between the interfaces in the model. This high coincidence leads to a tendency of the interface to maintain a coherent form in which the outermost silicon atoms of the substrate that are bonded to the aluminum nanofilm tend to stick with the aluminum atoms under tensile loads. This phenomenon was verified by interface energy calculations in the simulation models.

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Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique

Cited by 11 publications

References 10 publications

Effect of Ball Milling Time on the Microstructure and Properties of High-Silicon–Aluminum Composite

Effect of Ball Milling Time on the Microstructure and Properties of High-Silicon–Aluminum Composite

Effect of sintering process on microstructure and properties of Al–Si alloy made by powder metallurgy for electronic packaging application

Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems

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