In this study, tensile tests on aluminum/silicon vertically cracked nanofilm/substrate systems were performed using atomistic simulations. Various crystallographic orientations and thicknesses of the aluminum nanofilms were considered to analyze the effects of these factors on the reliability of the nanofilm/substrate systems. The results show that systems with some specific crystallographic orientations have lower reliability compared to the other orientations because of the penetration of the vertical crack into the silicon substrate. This penetration phenomenon occurring in a specific model is related to a high coincidence of atomic matching between the interfaces in the model. This high coincidence leads to a tendency of the interface to maintain a coherent form in which the outermost silicon atoms of the substrate that are bonded to the aluminum nanofilm tend to stick with the aluminum atoms under tensile loads. This phenomenon was verified by interface energy calculations in the simulation models.
The silicon/carbon nanotube (core/shell) nanocomposite electrode model is one of the most promising solutions to the problem of electrode pulverization in lithium-ion batteries. The purpose of this study is to analyze the mechanical behaviors of silicon/carbon nanotube nanocomposites via molecular dynamics computations. Fracture behaviors of the silicon/carbon nanotube nanocomposites subjected to tension were compared with those of pure silicon nanowires. Effective Young’s modulus values of the silicon/carbon nanotube nanocomposites were obtained from the stress and strain responses and compared with the asymptotic solution of continuum mechanics. The size effect on the failure behaviors of the silicon/carbon nanotube nanocomposites with a fixed longitudinal aspect ratio was further explored, where the carbon nanotube shell was found to influence the brittle-to-ductile transition behavior of silicon nanowires. We show that the mechanical reliability of brittle silicon nanowires can be significantly improved by encapsulating them with carbon nanotubes because the carbon nanotube shell demonstrates high load-bearing capacity under tension.
Recently, many researchers in the semiconductor industry have attempted to fabricate copper with carbon nanotubes for developing efficient semiconductor systems. In this work, tensile tests of a carbon-nanotube-reinforced copper specimen were conducted using the molecular statics method. The copper substrate utilized in the tensile tests had an edge half-crack, with the carbon nanotube located on the opposite side of the copper substrate. Subsequently, the effects of carbon nanotube radius were investigated. The mechanical properties of the copper/carbon nanotube composite were measured based on the simulation results, which indicated that the atomic behavior of the composite system exhibited the blocking phenomenon of crack propagation under tension. The fracture toughness of the composite system was measured using the Griffith criterion and two-specimen method, while the crack growth resistance curve of the system was obtained by varying the crack length. This study demonstrated that the mechanical reliability of copper can be improved by fabricating it with carbon nanotubes.
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