Advanced fine line double printing process for manufacturing high efficiency silicon wafer solar cells

Shetty, Kishan Devappa; Kaushal, Yudhbir; Murthy, D. S.; Kumar, Chandra Mauli

doi:10.1016/j.solener.2019.01.020

Cited by 5 publications

(1 citation statement)

References 4 publications

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“…The schematic diagram of ink transfer is shown in Figure 1. Printing quality requires good use performance and high precision [12][13][14][15][16]. The key to high-quality printing is to establish a printing technology with high resolution and Ink Transferring Rate.…”

Section: Introductionmentioning

confidence: 99%

Research on Surface Modification of Screen Printing Electronics

Tian

Yuan³

et al. 2021

Preprint

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Printing electronic components by screen printing with its excellent printing quality, high efficiency, and green environmental protection have broad application prospects in additive manufacturing. However, efficiency and quality of printing were decreased as conductive-ink blocking screen in the actual process of printing. Thus, it is pivotal that exploring factors of adhesion from the interaction of conductive-ink and screen. Herein, the functional relationship between adhesion and factors of adhesion and influence trend of adhesion on ink residue was obtained via the establishment of liquid-bridge adhesion model between two plates according to screen printing ink transfer process, solid-liquid wetting theory, and adhesion mechanism, which was verified by software Fluent. In order to justify the accuracy of the model and simulation, the adhesion and ink residue were tested on the surface-modified glass sheet as the result that the model and simulation were consistent with the experimental record. It was demonstrated that solid-liquid contact angle, tensile distance, and liquid volume are the main factors affecting the change of solid-liquid adhesion. With the increase of tensile distance and contact angle, the adhesion force decreases, which causes the decline of the residual amount of liquid on the solid surface. By means of screen modification, the adhesion between conductive-ink and screen can be reduced, as meanwhile the efficiency and quality of printed products can be improved.

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Section: Introductionmentioning

confidence: 99%

Research on Surface Modification of Screen Printing Electronics

Tian

Yuan³

et al. 2021

Preprint

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Investigation of contact formation mechanism and application of copper-based front contact paste for crystalline silicon solar cells

Choi

Bae

Han

et al. 2023

Solar Energy Materials and Solar Cells

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Conventional Substrates for Printed Electronics

2022

Printed Electronics Technologies

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Selection of a suitable printing substrate is also an important issue for obtaining good printed electronics devices. In this chapter, the common printing substrates and their properties are demonstrated. Among them, plastic substrates exhibit high thermal expansion coefficients and require careful selection in the case of a thermal step in the fabrication process. Paper substrates have been considered as a low-cost and environmentally-friendly alternative to plastic substrates for printed electronics. Textiles have become popular because of the rapid development of wearable electronics. Choosing a suitable substrate is the first challenge for printed electronics.

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Advanced fine line double printing process for manufacturing high efficiency silicon wafer solar cells

Cited by 5 publications

References 4 publications

Research on Surface Modification of Screen Printing Electronics

Research on Surface Modification of Screen Printing Electronics

Investigation of contact formation mechanism and application of copper-based front contact paste for crystalline silicon solar cells

Conventional Substrates for Printed Electronics

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