Advanced Electronic Packaging

Ulrich, Richard K.; Brown, W.D.

doi:10.1109/9780471754503

Cited by 85 publications

(48 citation statements)

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“…Vertical integration improves the bandwidth from core to cache memory, by reducing wiring length. Furthermore, it helps in obtaining a larger processor area, which effectively becomes the number of dies in the stack times the maximum projected lithography size for two-dimensional chips (Ulrich and Brown 2006). Therefore, the semiconductor industry is investing heavily into the development of through-silicon vias (TSV), which are the most important building blocks toward three-dimensional (3D) integration.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics

et al. 2011

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Hydrodynamics in microcavities with cylindrical micropin fin arrays simulating a single layer of a watercooled electronic chip stack is investigated experimentally. Both inline and staggered pin arrangements are investigated using pressure drop and microparticle image velocimetry (lPIV) measurements. The pressure drop across the cavity shows a flow transition at pin diameter-based Reynolds numbers (Re d ) *200. Instantaneous lPIV, performed using a pH-controlled high seeding density of tracer microspheres, helps visualize vortex structure unreported till date in microscale geometries. The post-transition flow field shows vortex shedding and flow impingement onto the pins explaining the pressure drop increase. The flow fluctuations start at the chip outlet and shift upstream with increasing Re d . No fluctuations are observed for a cavity with pin height-todiameter ratio h/d = 1 up to Re d *330; however, its pressure drop was higher than for a cavity with h/d = 2 due to pronounced influence of cavity walls.

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Section: Introductionmentioning

confidence: 99%

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics

et al. 2011

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“…Impedance is a measure of the overall opposition of an electrical circuit to an alternating current at a given frequency [6]. It has three components: resistance, inductive reactance, and capacitive reactance.…”

Section: Solder Joint Degradation Measurementmentioning

confidence: 99%

Detection of solder joint degradation using RF impedance analysis

Kwon

Azarian

Pecht

2008

2008 58th Electronic Components and Technology Conference

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The trend for many types of electronic products is toward higher operating frequencies or digital bit rates. At high frequencies, signal propagation is concentrated at the surface of interconnects, a phenomenon known as the skin effect. Degradation of interconnects, such as cracking of solder joints due to fatigue or shock loading, also usually initiates at the surface and propagates inward. Therefore, even a small crack at the surface of a solder joint may affect the performance of high speed electronic assemblies. Traditional DC resistance measurements are not appropriate for detecting such a small fault. More accurate and sensitive alternatives are required for monitoring the reliability of current and future electronic products. RF impedance analysis offers an improved means of sensing interconnect degradation.This study demonstrates the use of RF impedance changes as an early indicator of physical degradation of solder joints, due to the skin effect, and compares this to DC resistance measurements. Mechanical shear tests at an elevated temperature have been conducted with an impedancecontrolled circuit board on which a surface mount component was soldered. Simultaneous measurements were performed of DC resistance and the time domain reflection coefficient, as a measure of RF impedance, while the solder joints were stressed. The RF impedance was observed to increase in response to cracking of the solder joint earlier than the DC resistance. These results were qualitatively repeatable over multiple trials. IntroductionAs clock speeds and communication frequencies rise, the performance and reliability of electronic products are becoming increasingly sensitive to the integrity of the interconnects across which signals travel. Common interconnects include solder joints, printed circuit board traces, and connectors. These interconnects are susceptible to fatigue failures, which are generally initiated by cracks in the circumferential area where the strain range is maximized, and propagate inward [1][2][3][4].At high operating frequencies, the signal propagation is concentrated at the surface of interconnects. This phenomenon is known as the skin effect. The skin depth refers to the thickness of the conductor within which approximately 63% of the signals is contained [5]. As shown in equation (1), the skin depth, δ, is directly related to the frequency, f, and the resistivity of the conductor, ρ:

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“…The solidified phases and their microstructure are crucial to solder joint properties. [1][2][3][9][10][11] Therefore, knowledge of the undercooling behavior of Sn-based alloys is valuable for their applications as solders.…”

Section: Introductionmentioning

confidence: 99%

“…Soldering is the most important joining method in the electronics industry [1][2][3][4][5] and has become even more important recently because of the Pb-free requirement and more advanced applications, such as flip chip and through silicon via (TSV) technologies. [3][4][5] Different sizes of solder joints are produced in different packaging levels, such as the TSV, flip chip, and printed circuit board.…”

Section: Introductionmentioning

confidence: 99%

Size and Substrate Effects upon Undercooling of Pb-Free Solders

Huang

Chen

2009

Journal of Elec Materi

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The degrees of undercooling of various Pb-free solders are determined using differential scanning calorimetry. The effects of size, composition, and substrate upon undercooling are examined. Ni is the most effective element among Cu, Ni, and Ag in reducing the undercooling of Sn solders, both as an alloying addition and as a substrate. The degrees of undercooling and their variations are more significant for smaller-sized solders, but the relative orders of undercooling of various solders remain the same. It is concluded that the primary factors controlling undercooling are the primary solidification phase and the substrate. Different compositions of melts could have different primary solidifications, resulting in different degrees of undercooling. When the primary solidification phase and the substrates are the same, the degrees of undercooling could be different if the compositions of the melts are different. However, this compositional effect is not very significant.

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Advanced Electronic Packaging

Cited by 85 publications

References 0 publications

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics

Detection of solder joint degradation using RF impedance analysis

Size and Substrate Effects upon Undercooling of Pb-Free Solders

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