Advanced ceramic packaging for microwave and millimeter wave applications

Book of Abstracts of the 4th Symposium on Electrical and Computer Engineering

“…Increasing operating frequency leads to reduce package size, which can adversely affect package reliability and performance. Additionally, for a small package, the process tolerances are more pronounced and can cause electrical performance and yield degradation (Wein 1995). The wire-bond technology has been applied for power amplifier MMIC-packaging only at module level up to kaband (Bessemoulin et al 2006;Lin et al 2012).…”