Advanced ATM-layer function MCM-D module for ATM wide-area network

Abstract

This paper describes a high-performance and costeffective MCM-D module for an ATM-layer function device. The MCM-D module is fabricated on a Sisubstrate using the stacking RAM technique to reduce module size. The MCM has a 4-layer Si substrate, a high-performance ASIC, 8 high-speed S U M S , and an FPGA. By using the stacking RAM technique, MCM-D module size was reduced to 50.8 mm x 50.8 mm.This is 40 % of that (100 mm x 65 mm) of a doubleside mounted sub-board module with conventional packaging(QFP and SOP). The MCM-D module realizes be very small with very large-capacity and high-speed memory.A high-performance and cost-effective ATM-layer function MCM-D module was fabricated. The MCM-

Development of plastic chip scale package for ATM switching systems

“…To meet this demand, an ATM switching system offering several tens of Gb/s throughput has been develope421. Aational ATM switching systems have been developed even more recently [3], [4]. At the same time, an urgent dmand exists for units that are space efficient and cost effective.…”