Advanced ATM switching system hardware technology using MCM-D, stacking RAM microprocessor module

Yamanaka, Naoaki; Kawamura, Teruo; Kaizu, K.; Harada, Akio

doi:10.1109/ectc.1998.678812

Cited by 2 publications

(2 citation statements)

References 4 publications

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“…With this information and knowing the dimensions of the spiral inductors, the actual dielectric thickness may be determined. For gaps, the correction factor to do this is (13) with being the feature size in micrometers.…”

Section: ) Corrections For Planarization Effectsmentioning

confidence: 99%

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Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications

Pieters¹,

Vaesen

Brebels

et al. 2001

IEEE Trans. Microwave Theory Techn.

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In the current trend toward portable applications, high-integrated inductors are gaining a lot of importance. Using thin-film multilayer or multichip-module-deposition technology, high-circular inductors for RF and microwave applications may be integrated efficiently. Their quality factors may go up to over 100. In this paper, an accurate analytical model for such multiturn circular spiral inductors embedded in a thin-film multilayer topology is presented. Starting from the geometrical parameters, the model provides an accurate prediction of the inductance value, factor and frequency behavior of the inductor. This allows a "first-time-right"' realization of the integrated component and provides opportunities for fast optimization of the inductors. Finally, the presented high-inductors have been used in various integrated RF and microwave subsystems for wireless applications, of which a number are discussed at the end of this paper.

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Section: ) Corrections For Planarization Effectsmentioning

confidence: 99%

“…Therefore, the correction factor given in (13) has to be included in the calculation of the effective dielectric constants using (10), such that the effective dielectric thickness is taken into account.…”

Section: ) Corrections For Planarization Effectsmentioning

confidence: 99%

Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications

Pieters¹,

Vaesen

Brebels

et al. 2001

IEEE Trans. Microwave Theory Techn.

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Development of plastic chip scale package for ATM switching systems

Harada

Kaizu

Yamanaka

et al.

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)

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A plastic chip-scale package (CSP) smaller than conventional ones has been developed and applied to ATM switching systems. It uses a lowcost glass-epoxy substrate. Because glass epoxy is widely used in the printed circuit boards (PCBs) of ATM switching systems, its use in the CSPs mounted on a PCB d u c e s the difference in thermal expansion between the PCB and CSPs, thus lengthening CSP life. The power plane, ground plane, and thermal vias of the CSP are designed to offset the increased thermal resistance &e to the CSP's smaller size. Simulation showed a thermal resistance for this CSI' with copper layers and thermal vias of as much as 22% less than that of one with no copper layers or thermal vias. A six-layer test board mounting four CSPs was used to simulate a sub-board for ATM switching systems. The thermal resistance of the two CSPs located downstream was about 10% higher ttian that of the two located upstream. Two CSPs were developed for two types of application-specific ICs: a bus interface controller @IC) and a peripheral interface circuit (PIC). Both CSPs were18 mm square with a 0.8-mm outer solder-ball pitch and 256 outer balls. These CSPs m p i e d areas about 87% and 68% smaller than those of a conventional pin grid m y (PGA) and quad flat package (QFP), respectively. The junction temperature of both CSPs satisfied the thermal condition. Thesehigh-performance CSPs are thus attractive for use in ATM switching systems.

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Advanced ATM switching system hardware technology using MCM-D, stacking RAM microprocessor module

Cited by 2 publications

References 4 publications

Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications

Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications

Development of plastic chip scale package for ATM switching systems

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