2015 16th International Conference on Electronic Packaging Technology (ICEPT) 2015
DOI: 10.1109/icept.2015.7236571
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Advance semiconductor package applied on high efficiency dual-mode DC-DC buck converter

Ching-Yen Ho
1
,
Hung-Hsiang Cheng
2
,
Ming-Feng Chung
3
et al.
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Cited by 4 publications
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References 13 publications
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Modeling high current integrated power converters

Gabian
1
,
Gamble
2
,
Blalock
3
et al. 2017
2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL)
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Modeling high current integrated power converters

Gabian
1
,
Gamble
2
,
Blalock
3
et al. 2017
2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL)
1
0
0
0
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Package Model for DC-DC Converters Design

Tedesco,
Bottaro,
Denaro
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Numerical approach to study layout influence on electromagnetic emissions signature

Belloumi
1
,
Bréard
2
,
Slama
3
et al. 2018
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Comp
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