Summary: Epoxy resins are widely used in electronics and electric industries because of their superior properties. In recent years, excellent bonding properties for metals (e.g., copper, gold, aluminium, silver, etc.), to which it is hard to adhere, have become desirable for epoxy resins in the electric and electronics industrial fields. However, epoxy resins have only poor bonding strength to the metals. In order to increase the heterojunction strength between epoxy resins and copper, the introduction of sulfur, providing strong interactions with metals, was investigated. TDP polyester and MPS polythioesters containing sulfur moieties were employed as the sulfur‐containing modifiers for the epoxy resin. Epoxy resins containing a modifier (5–20 phr) and a curing agent were cured between copper plates at 120 °C for 2 h and at 170 °C for 2 h. The effect of the added modifiers was evaluated by the lap‐shear testing method. It could be demonstrated that MPS polythioesters have a beneficial effect on the enhancement of the epoxy resin/copper heterojunction. The most effective example was the addition of 20 phr of the MPS_7 polythioester, which increased the lap shear strength from 5.7 to 17 MPa.Improvement of lap shear strengths of adhesive copper joints by sulfur‐containing modifiers.magnified imageImprovement of lap shear strengths of adhesive copper joints by sulfur‐containing modifiers.