Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors

Pang, Cheng; Zhao, Zhan; Du, Lidong; Fang, Zhen

doi:10.1016/j.sna.2008.06.001

Cited by 37 publications

(21 citation statements)

References 9 publications

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“…This is attributed to the smaller parasitic capacitance caused by the SU-8 layer. In addition, the simulation results listed in Table 2 show that design 3 has the lowest stress levels among all three designs, particularly the bonding shear stress between Si and SU-8, which should not exceed 17.15 MPa (Pang et al, 2008). Bonding surface shear stress in the presented designs results from the difference in thermal expansion between SU-8 and Si.…”

Section: Numerical Analysismentioning

confidence: 91%

“…Feng and Farris (2003) show that the process of fabricating SU-8 can change its mechanical properties. In this research, it is assumed that the SU-8 mechanical properties and shear bonding strength are as presented by Pang et al (2008) and Guerin (2008) respectively. This technique improves the overall sensor robustness and reduces the temperature sensitivity of the transducer.…”

Section: Analytical Mechanical Analysismentioning

confidence: 99%

“…20, the vacuum chamber is sealed hermetically using anodic bonding, and the electrodes are bonded, and isolated, using SU-8 photoresist. SU-8 is low cost, easy to process, and a good isolation material for capacitive pressure sensor application, and it can work as an adhesive bonder too (Chang and Allen, 2004;Pang et al, 2008).…”

Section: Mems Capacitive Pressure Sensor Micro-fabricationmentioning

confidence: 99%

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A micro-capacitive pressure sensor design and modelling

Kubba

Hasson

Kubba

et al. 2016

J. Sens. Sens. Syst.

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Abstract. Measuring air pressure using a capacitive pressure sensor is a robust and precise technique. In addition, a system that employs such transducers lies within the low power consumption applications such as wireless sensor nodes. In this article a high sensitivity with an elliptical diaphragm capacitive pressure sensor is proposed. This design was compared with a circular diaphragm in terms of thermal stresses and pressure and temperature sensitivity. The proposed sensor is targeted for tyre pressure monitoring system application. Altering the overlapping area between the capacitor plates by decreasing the effective capacitance area to improve the overall sensitivity of the sensor ( C/C), temperature sensitivity, and built-up stresses is also examined in this article. Theoretical analysis and finite element analysis (FEA) were employed to study pressure and temperature effects on the behaviour of the proposed capacitive pressure sensor. A MEMS (micro electro-mechanical systems) manufacturing processing plan for the proposed capacitive sensor is presented. An extra-low power short-range wireless read-out circuit suited for energy harvesting purposes is presented in this article. The developed read-out circuitry was tested in terms of sensitivity and transmission range.

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Section: Numerical Analysismentioning

confidence: 91%

Section: Analytical Mechanical Analysismentioning

confidence: 99%

Section: Mems Capacitive Pressure Sensor Micro-fabricationmentioning

confidence: 99%

See 1 more Smart Citation

A micro-capacitive pressure sensor design and modelling

Kubba

Hasson

Kubba

et al. 2016

J. Sens. Sens. Syst.

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show abstract

“…Capacitive pressure sensor is one of the most promising devices drawn a considerable attention in researches and applications because of its relatively high sensitivity, low power consumption, robust structure, and low temperature drift [1][2][3][4][5][6]. However, for the absolute type capacitive pressure sensor, there is a big challenge of how to connect the capacitive electrodes with the outside pads through the silicon-glass bonding interface without affecting its vacuum packaging processes.…”

Section: Introductionmentioning

confidence: 99%

Localized Si–Au eutectic bonding around sunken pad for fabrication of a capacitive absolute pressure sensor

Liu

Zhao

et al. 2013

Sensors and Actuators A: Physical

Self Cite

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“…Parylene has been used as an intermediate layer for wafer-level bonding (Kim and Najafi 2005;Noh et al 2004), though it is a thermoplastic polymer that becomes soft at high temperatures. Recently, SU-8 TM , a photosensitive polymer, has been used as a structural adhesive material for wafer bonding (Pan et al 2002;Pang et al 2008).…”

Section: Introductionmentioning

confidence: 99%

A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

2010

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We have developed a compensated capacitive pressure and temperature sensor for kraft pulp digesters (pH 13.5, temperatures 25-175°C reaching a local maximum of 180°C and pressures up to 2 MPa). The gauge capacitive pressure sensor was fabricated by bonding silicon and Pyrex chips using a high temperature, low viscosity UV (ultraviolent) adhesive as the gap-controlling layer and heat curing adhesive as the bonding agent. A simple chip bonding technique, involving insertion of the adhesive into the gap between two chips was developed. A platinum thin-film wire was patterned on top of a silicon chip to form a resistance temperature detector (RTD) with a nominal resistance of 1,500 X. A silicon dioxide layer and a thin layer of Parylene were deposited to passivate the pressure sensor diaphragm and the sensors were embedded into epoxy for protection against the caustic environment in kraft digesters. The sensors were tested up to 2 MPa and 170°C in an environment chamber. The maximum thermal error of ±1% (absolute value of ±20 kPa) full scale output (FSO) and an average sensitivity of 0.554 fF/kPa were measured. Parylene-coated silicon chips were tested for a full kraft pulping cycle with no signs of corrosion.

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Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors

Cited by 37 publications

References 9 publications

A micro-capacitive pressure sensor design and modelling

A micro-capacitive pressure sensor design and modelling

Localized Si–Au eutectic bonding around sunken pad for fabrication of a capacitive absolute pressure sensor

A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

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