Adhesion Strength of Nickel Films Deposited on Aluminum Surface in a Foam of Electrolyte

Yamada, Y.; Sugawara, Tomohiro; Furuhashi, Takahiro; Ichihara, Shoji; Usui, Hiroaki

doi:10.4139/sfj.63.329

Cited by 3 publications

(3 citation statements)

References 6 publications

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“…23,24) The control of crystal grain size led to the improvement in the mechanical strength of the deposited films. 25) It is expected that these advantages of the electroplating method using foam of electrolyte can also be utilized to solve the current issues of electroless plating. We explore the possibility of achieving electroless plating in foam of plating solution instead of the conventional liquid plating solution.…”

Section: Introductionmentioning

confidence: 99%

Electroless plating of Ni thin films using foam of electrolyte

Furuhashi

Yamada²,

Ichihara

et al. 2015

Jpn. J. Appl. Phys.

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Electroless plating of Ni thin films was achieved in foam of electroplating solution in place of electroplating liquid. Commercial hypophosphite-based solution for Ni electroless plating was added with a surfactant of sulfuric acid monododecyl ester sodium salt (SDS) and bubbled with nitrogen gas to produce airy foam. Ni thin films were deposited by immersing iron substrates in the foam. Although stationary foam was inconvenient for electrodeposition by itself, film growth was enhanced by generating a flow of foam using substrate rotation and by adding SDS to a concentration of 0.1 to 0.3 wt %. No defects attributed to pinholes were observed on the film surface. This method was effective in reducing the net amount of plating solution necessary for film deposition.

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Section: Introductionmentioning

confidence: 99%

Electroless plating of Ni thin films using foam of electrolyte

Furuhashi

Yamada²,

Ichihara

et al. 2015

Jpn. J. Appl. Phys.

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“…This foam contained large quantity of gas cells and was different from the bubbles conventionally used for agitating the solution. It was found that the number of pits and pinholes can be reduced by using the foam electrolyte 14) , 15) . The foam electrolyte can remove the hydrogen bubbles on the cathode surface by mechanisms such as merging the hydrogen bubbles into the bubbles of the foam, or repelling the hydrogen bubbles by collisions with them, depending on the stability of the foam 16) .…”

Section: Introductionmentioning

confidence: 99%

“…It was found that the number of pits and pinholes can be reduced by using the foam electrolyte 14) , 15) . The foam electrolyte can remove the hydrogen bubbles on the cathode surface by mechanisms such as merging the hydrogen bubbles into the bubbles of the foam, or repelling the hydrogen bubbles by collisions with them, depending on the stability of the foam 16) . In our previous report, the unstable foam electrolyte was generated by adding a small amount (2-6×10 -3 wt%) of surfactant (sulfuric acid monododecyl ester sodium salt: SDS) to the conventional Watt bath.…”

Section: Introductionmentioning

confidence: 99%

Electroplating of Nickel Films Using Stable Foam Electrolyte Solution

Yamada¹,

Fujisawa

Furuhashi³

et al. 2012

Journal of The Surface Finishing Society of Japan

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Improvement of Wire Bond Strength to Electroless Au/Pd/Ni-P Plating Pads on Printed Wiring Boards by Knocking in Plating Bath

Arakawa

Watanabe

et al. 2014

Electrochemistry

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Au wire bond strength on Cu interconnects printed wiring boards was investigated for electroless Au/Pd/Ni-P pads plating prepared with knocking substrates in plating baths. A scanning electron microscope revealed that the surface of NiP plating formed with knocking was smoother than that of NiP plating formed without knocking. Furthermore, X-ray photoelectron spectroscopy indicated that no a Ni peak was recognized on Au/Pd/Ni-P plating formed with knocking, while a Ni peak was observed on ones formed without knocking. The wire bond strength to Au/Pd/Ni-P plating pads formed with knocking was larger than that to ones formed without knocking. These findings are due to removing hydrogen from a NiP surface by knocking substrates during formation of NiP plating.

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Adhesion Strength of Nickel Films Deposited on Aluminum Surface in a Foam of Electrolyte

Cited by 3 publications

References 6 publications

Electroless plating of Ni thin films using foam of electrolyte

Electroless plating of Ni thin films using foam of electrolyte

Electroplating of Nickel Films Using Stable Foam Electrolyte Solution

Improvement of Wire Bond Strength to Electroless Au/Pd/Ni-P Plating Pads on Printed Wiring Boards by Knocking in Plating Bath

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