Electroless plating of Ni thin films using foam of electrolyte

Abstract

Electroless plating of Ni thin films was achieved in foam of electroplating solution in place of electroplating liquid. Commercial hypophosphite-based solution for Ni electroless plating was added with a surfactant of sulfuric acid monododecyl ester sodium salt (SDS) and bubbled with nitrogen gas to produce airy foam. Ni thin films were deposited by immersing iron substrates in the foam. Although stationary foam was inconvenient for electrodeposition by itself, film growth was enhanced by generating a flow of foam using substrate rotation and by adding SDS to a concentration of 0.1 to 0.3 wt %. No defects attributed to pinholes were observed on the film surface. This method was effective in reducing the net amount of plating solution necessary for film deposition.

Surface deformation studies of TiO2 thin films by double exposure laser holographic interferometry

“…Many techniques are available and employed successfully to synthesize TiO 2 thin films. The spray pyrolysis [12], screen printing [13], dip-coating [14], electroplating [15], chemical vapor deposition [16], sputtering [17], thermal * Author to whom any correspondence should be addressed. evaporation [18] chemical bath deposition [19], pulsed laser deposition [20] and atomic layer deposition [21] and the spin coating methods are used.…”

Improvement on electrical properties of screen-printed silicon solar cells by light-induced electroplating of silver

“…[10][11][12][13][14][15][16][17][18][19][20][21] In this paper, the focus is on the two-layer electrode of light-induced electroplating after screen-printing. [22][23][24][25] The total power losses, consisted by optical losses and electrical losses, are analyzed for different seed layer electrodes widths by screen-printing in the calculation. With low broadening of the silver fingers and high rate deposition of silver, the light-induced electroplating process has potential to elevate solar cells efficiency by bringing down greatly the series resistance.…”