Adhesion, Reaction and Stability of Metal/Polyimide Interfaces

Kim, J.; Kowalczyk, S. P.; Kim, Y. H.; Chou, N. J.; Oh, Tae-Sung

doi:10.1557/proc-167-137

Cited by 15 publications

(4 citation statements)

References 11 publications

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“…19 In a high-resolution electron energy loss spectroscopy (HREELS) and ultraviolet photoemission spectroscopy (UPS) study they found Chromium. The chemical interaction between thermally evaporated chromium (which is used as an adhesion promoter and diffusion barrier for copper/polyimide layers 20 ) and polyimide has been a subject of numerous studies. Chromium/polyimide interfaces have been studied mainly by XPS 5, [21][22][23][24][25][26][27] .…”

Section: Introductionmentioning

confidence: 99%

Identification of Physical and Chemical Interaction Mechanisms for the Metals Gold, Silver, Copper, Palladium, Chromium, and Potassium with Polyimide Surfaces

et al. 1996

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In this article we briefly review the literature for the evaporated metals gold, silver, copper, palladium, chromium, and potassium on polyimide surfaces and compare these previous results to newer experiments using Fourier transform infrared reflection absorption spectroscopy (FT-IRAS) and near edge X-ray absorption fine structure spectroscopy (NEXAFS). The polyimide films were prepared by vapor phase deposition. Metal coverages range from submonolayer to several monolayers, but special emphasis in this work is put on the interaction of metals with a polyimide surface at very low metal coverages. Before our new results are presented, we discuss the various chemical and nonchemical effects, which can contribute to the change in IR absorption of polymers. For all of the metals except potassium only attenuation of polymer IR bands is observed. For the metal deposits of Au, Cu, Ag, and Pd the attenuation of the IR bands can be explained by a purely physical interaction mechanism, i.e., dynamical dipole screening and changes in the intermolecular dipole-dipole coupling between the polymer macromolecules. Deposition of potassium leads to very different and characteristic changes of the polymer IR bands and of the NEXAFS spectra which can conclusively be explained with an electron transfer from the potassium onto the polyimide. In the case of chromium the IR and NEXAFS data indicate that the chemical and physical interaction of chromium with polyimide is very complex already at the initial stage of the metal/polymer interface formation and cannot be explained conclusively with any of the interaction models suggested in the literature.

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Section: Introductionmentioning

confidence: 99%

Identification of Physical and Chemical Interaction Mechanisms for the Metals Gold, Silver, Copper, Palladium, Chromium, and Potassium with Polyimide Surfaces

et al. 1996

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“…2c, due to the dissolution of the Cu 2 O layer in the organic acid in PI during the imidization process. 17 A point to be noted here is that the surface morphology of the Cu oxide does not seem to affect the peel strength of the Cu/PI interface significantly. As measured by atomic force microscopy (AFM), the surface roughnesses (Ra) for specimens of types A and B were 13.7 nm and 3.1 nm, but their peel strengths were 664.4 J/m 2 and 1062 J/m 2 , respectively, showing no correlation between Ra and peel strength.…”

Section: Effects Of Heat Treatment At 300°c Under 5% O 2 Atmospherementioning

confidence: 64%

Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide

Lee

2008

Journal of Elec Materi

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In this study, various copper oxides [CuO, Cu 2 O, and Cu 2 O + polybenzimidazole (PBI)] were studied as alternative adhesion layers. Specimens were aged under harsh conditions (300°C, 5% O 2 or humid condition), and then peel tests were conducted to investigate the reliability of Cu oxides/polyimide (PI). The peel strength of the bare Cu, CuO, and Cu 2 O specimens dropped substantially, close to nil, due to void formation after 2 h of aging at 300°C. The degree of void formation near the Cu 2 O/Cu interface showed a clear inverse relationship with the peel strength, suggesting that the formation of voids beneath the Cu 2 O layer was directly responsible for the peel strength degradation. Void growth was controlled by Cu 2 O layer growth, while voids originated from the difference between the diffusion rate of Cu atoms through the Cu 2 O layer and Cu layers. Humidity tests did not lower the peel strength significantly in any of the specimens, none of which showed voids that were detrimental to the peel strength, in contrast to the results of the aging treatments at 300°C.

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“…Adhesion-promoting effect was found to be in the following order CH 2 -CH 2 oNH 2 ⪡OH o-COOH [42]. Another study showed that the polyamic acid creates a stronger bond to metal than cured PI [43], because of reactions occurring between the acid and the metal. Therefore the presence of COOH groups found by ATR can be responsible for the better adhesion of PI1 and thicker transfer at the surface of the counterface in H 2 .…”

Section: Pure Pimentioning

confidence: 98%