Adhesion of polyimides to metal and ceramic surfaces: an overview

Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage

“…A thin layer of adhesion promoter (organosilane) is usually spin coated before PI deposition. [3][4][5] Virtually all standard polyimides used in electronics are also commercialized in the form of self-priming precursors, containing small amounts of organosilane. Photosensitive polyimides are also commercially available.…”

Photosensitive Polyimide for Packaging Applications

“…In general, siloxane couplers were used for improvement of adhesion to Si, SiO and SiN [6]. Aluminum chelate was added for metal and Si substrates [7].…”

Temperature and humidity effects on adhesion of polyimide film to a silicon substrate

“…There are several techniques for determining adhesion, ranging from the Scotch-tape test to the pull test and peel test [4,5]. In this study, the peel test was chosen as the adhesion measurement technique because the interpretation of peel measurement results is widely reported in many related polymer-substrate interface systems [6,7].…”

“…The peel force, which represents the force needed to peel off a film from a substrate, is influenced by mechanical factors, such as film thickness, yield strength, Poisson's ratio, and stiffness, as well as the fundamental adhesion between the film and the substrate [6]. The peel behavior of polyimide films has been evaluated extensively (see, for example, refs 6-10).…”