2014
DOI: 10.1109/tdmr.2014.2343793
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Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications

Abstract: Abstract-In this paper, the interfacial adhesion strength between metal layer and benzocyclobutene (BCB) polymer dielectric in 3-D integration applications is investigated. The effects of layer thickness, layer stacking order, and additional adhesion layer of titanium (Ti) layer between copper (Cu) and BCB polymer are investigated. Surprisingly, the conventional titanium adhesion layer commonly used in the semiconductor industry weakens the interfacial adhesion strength between copper and BCB. Additionally, to… Show more

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Cited by 7 publications
(1 citation statement)
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“…The reflected SFG beam was guided through a monochromator, and a photomultiplier tube (Hamamatsu) was used to measure the intensity of the SFG beam while the infrared beam was scanned in the 2800–3100 cm –1 range. Descriptions of SFG theory and applications can be found elsewhere. …”
Section: Experimental Sectionmentioning
confidence: 99%
“…The reflected SFG beam was guided through a monochromator, and a photomultiplier tube (Hamamatsu) was used to measure the intensity of the SFG beam while the infrared beam was scanned in the 2800–3100 cm –1 range. Descriptions of SFG theory and applications can be found elsewhere. …”
Section: Experimental Sectionmentioning
confidence: 99%