Adhesion improvement of Epoxy Molding Compound – Pd Preplated leadframe interface using shaped nickel layers

Ni, Mingzhi; Li, Ming; Mao, Dali

doi:10.1016/j.microrel.2011.07.095

Cited by 14 publications

(4 citation statements)

References 15 publications

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“…Further observation on macroscopic level shows that only a thin epoxy film attached to the substrate. According to Ni's research, 23 such kind of fracture type can be regarded as adhesive failure that often occurs at the interface between adhesives and base materials due to poor adhesion. While in Fig.…”

Section: Resultsmentioning

confidence: 99%

Enhanced Adhesive Bonding Based on Surface Modification with Silicon Nanowire Arrays

Feng

Cao

Wang

et al. 2015

ECS J. Solid State Sci. Technol.

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Adhesive bonding is one of the methods extensively used for 3D packaging, which has many advantageous features except for relatively poor bonding strength. In this paper, we present a novel method to strengthen adhesive bonding via modifying the wafer surface with silicon nanowire (SiNW) arrays. The SiNW was synthesized using a micro-electrochemical wet etching method. The nanostructure was characterized and its formation process was revealed in detail. Contact angle measurement and the observation of wetting frontier indicates good wetting behavior of epoxy adhesives on SiNW arrays. Adhesion strength increased 42% after the surface modification, accompanying with more failure occurring within the adhesive. A micromechanical composite structure model was proposed to demonstrate the interlock effect in the bonding interface. Bonding strengthening mechanism was investigated based on surface science theories.

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Section: Resultsmentioning

confidence: 99%

Enhanced Adhesive Bonding Based on Surface Modification with Silicon Nanowire Arrays

Feng

Cao

Wang

et al. 2015

ECS J. Solid State Sci. Technol.

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“…To achieve high reliability, a resin-metal interface, which is highly reliable even after the above-mentioned high-temperature operation, is required. Conventional methods to improve the bond strength of the epoxy resin-copper interface include chemical oxidation treatment of the copper plate, 5,6) roughening of the Ni plating film, 7,8) and laser roughening of the copper plate. 9) Anodization on aluminum plates 10) and laser roughening of the steel plates 11) have also been investigated for bonding of resin-metals other than copper.…”

Section: Introductionmentioning

confidence: 99%

Improvement in Copper-Resin Bond Strength after High-Temperature Testing Using C–H–Si Thin Film

2022

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The bonding between copper and epoxy resin is investigated using a CHSi thin film to achieve highly adhesive and reliable bonding between the resin mold and the copper substrate in power modules. In this study, high-temperature (473 K) testing is performed to improve the reliability of this junction after high-temperature operation. The bond strength decreases and delamination occurs at the filmcopper interface after high-temperature testing. The decrease in bond strength may be due to the decrease in the filmcopper interfacial strength because of the decrease in the binding force between copper and oxygen upon heating. When Fe and Cr, which have high oxygen bond disassociation energies, are intercalated at the filmcopper interface, the bond strength improves after high-temperature testing and a bond strength above 30 MPa was retained after 1000 h.This study is a novel method of dissimilar bonding based on chemical and physical effects of CHSi film existing between copper and resin. Further, it is an effective method of bonding to achieve high-temperature operation of a resin-molded power module, which can contribute to future advancements in power electronics products.

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“…A main function of plating is to reduce the growth of Cu oxide films during the packaging processes that are detrimental to adhesion. Several plating materials include Ag, Au, and Pd [2,17,18] have been used with varying degrees of success. Modification in surface topography is based on the principle of mechanical interlocking to improve the interfacial adhesion by introducing tiny holes or dimples etched on the Cu surface [2,18,19].…”

Section: Introductionmentioning

confidence: 99%

Enhancing the oxidation resistance of copper by using sandblasted copper surfaces

Yuan

Chen

Maganty

et al. 2015

Applied Surface Science

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We show that sandblasting can be employed to effectively enhance the oxidation resistance of copper by suppressing the interfacial delamination between copper and its oxide by modifying the surface roughness of Cu. Increasing sandblasting treatment time from 0 to 120 s increases the surface roughness of Cu from 0.12 ± 0.003 µm to 2.89 ± 0.176 µm, which results in improved oxidation resistance of the Cu surfaces and enhances the oxide/substrate interfacial fracture energy from 0.035 J/m 2 to 3.1 J/m 2 determined using nanoindentation. The sandblasting treatment has no appreciable effect on the Young's moduli of the Cu oxide film, which remain nearly constant at around 36 GPa. The improved oxidation resistance is ascribed to the enhanced interfacial adhesion of the sandblasted copper owning to the concave shape of craters generated by sandblasting, which results in a net downward force from the compressive stresses in the oxide film that forces the film to adhere to the Cu substrate.

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Adhesion improvement of Epoxy Molding Compound – Pd Preplated leadframe interface using shaped nickel layers

Cited by 14 publications

References 15 publications

Enhanced Adhesive Bonding Based on Surface Modification with Silicon Nanowire Arrays

Enhanced Adhesive Bonding Based on Surface Modification with Silicon Nanowire Arrays

Improvement in Copper-Resin Bond Strength after High-Temperature Testing Using C–H–Si Thin Film

Enhancing the oxidation resistance of copper by using sandblasted copper surfaces

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