Enhanced Adhesive Bonding Based on Surface Modification with Silicon Nanowire Arrays

Feng, Bin; Cao, Jian; Wang, Yifeng; Feng, Jicai

doi:10.1149/2.0141602jss

Cited by 4 publications

(2 citation statements)

References 24 publications

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“…An enhancement of the bonding strength can be achieved by surface modifications of silicon in the nanoscale. Surface enlargement and additional form fit affect adhesive bond strength and ductility of the interface [12,13]. Plasma etching of the silicon surface generates nanostructures by self-masking, the so-called black silicon [14].…”

Section: Introductionmentioning

confidence: 99%

Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers

2017

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Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerging technology. Their use promises low-stress assembly of components while improving thermal contact and reducing thermal resistance. Nanostructured surface modifications can significantly enhance adhesion and reliability of joints between different materials. This work examines reactive multilayer of nickel and aluminum, directly sputtered on nanostructured black silicon surfaces and compares their phase transformation with reference samples deposited on pristine silicon surface. The investigation of the quenched self-propagating reaction reveals a clear influence of the nanostructured surface on the prolongation of the phase transition. Rapid thermal annealing tests result in the formation of Al 1.1 Ni 0.9 phase. The nanostructured interface seems to hinder the full transformation of the parent material. The surface modification improves the adhesion of the formed alloy on silicon surfaces and can possibly increase the reliability of joints based on reactive aluminum/nickel multilayer. The use of black silicon, a nanostructured surface modification, is thus a promising approach to realize reliable multi-material joints in complex systems.

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Section: Introductionmentioning

confidence: 99%

Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers

2017

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“…It was 200 times slower than a RMS-foil with the same characteristics and the slower propagation was attributed to a reduction of the heat transfer due to the thermal resistances at the particle-particle interfaces [17,19]. Nanostructured Si has interesting properties such as surface enlargement that can be exploited in chip assembly [20]. For this reason, it was used as a substrate during the deposition of Al/Ni RMS [18].…”

Section: Introductionmentioning

confidence: 99%

Phase Transformation and Characterization of 3D Reactive Microstructures in Nanoscale Al/Ni Multilayers

et al. 2021

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Reactive multilayer systems represent an innovative approach for potential usage in chip joining applications. As there are several factors governing the energy release rate and the stored chemical energy, the impact of the morphology and the microstructure on the reaction behavior is of great interest. In the current work, 3D reactive microstructures with nanoscale Al/Ni multilayers were produced by alternating deposition of pure Ni and Al films onto nanostructured Si substrates by magnetron sputtering. In order to elucidate the influence of this 3D morphology on the phase transformation process, the microstructure and the morphology of this system were characterized and compared with a flat reactive multilayer system on a flat Si wafer. The characterization of both systems was carried out before and after a rapid thermal annealing treatment by using scanning and transmission electron microscopy of the cross sections, selected area diffraction analysis, and differential scanning calorimetry. The bent shape of multilayers caused by the complex topography of silicon needles of the nanostructured substrate was found to favor the atomic diffusion at the early stage of phase transformation and the formation of two intermetallic phases Al0.42Ni0.58 and AlNi3, unlike the flat multilayers that formed a single phase AlNi after reaction.

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Morphologies of Reactive Nanolayer Stacks Sputtered on Ceramic Low‐Temperature Cofired Ceramic Substrates Having a Micrometer‐Scale Surface Roughness

Wiss,

Schulz,

Ruh

et al. 2024

Adv Eng Mater

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The deposition of reactive multilayer systems (RMS) has been investigated on low temperature cofired ceramic (LTCC) substrates having different surface morphologies. This study analyses the morphologies of RMS layers that were deposited on glass ceramic LTCC substrates. Different surface morphologies were prepared through pretreatments of the LTCC surface. The considered surfaces encompass an untreated natural LTCC surface, a modified sintered LTCC surface by laser ablation, a surface with a deposited metallization layer and finally, a surface with an additional solder layer put on the deposited metallization layer. The different pretreatments lead to significant differences in the roughness of the LTCC substrates, resulting in different reaction velocities and peak temperatures on the various surface morphologies after the RMS’s reaction. As a result, different grades of structural integrity (lift‐off, crack formation) between the reacted RMS layer and the LTCC were observed.This article is protected by copyright. All rights reserved.

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Enhanced Adhesive Bonding Based on Surface Modification with Silicon Nanowire Arrays

Cited by 4 publications

References 24 publications

Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers

Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers

Phase Transformation and Characterization of 3D Reactive Microstructures in Nanoscale Al/Ni Multilayers

Morphologies of Reactive Nanolayer Stacks Sputtered on Ceramic Low‐Temperature Cofired Ceramic Substrates Having a Micrometer‐Scale Surface Roughness

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