“…It is well known that geckos can run rapidly on almost any surface due to the van der Waals force generated on intimate contact between the hierarchical microstructures (setae) on their toes and the contacted surfaces. , The rapid switch between the attachment and detachment state during locomotion is achieved by the dynamic and reversible mechanical deformation of its toes, which follows a typical peeling mechanism. , The high adhesion force, obtained when the toe is rolling in attachment, could decrease several orders of magnitude when the toe is rolling out detachment, as shown in Figure a. , Although some researchers have used a mechanical peeling mechanism to develop reversible adhesion devices, there are still several shortcomings in the reported design strategies. − First, the crack propagation mechanism between the smooth surface peeling device and the substrate limits its ability to grasp objects with curvature or roughness firmly. ,, Second, surface microstructures such as pillars and mushrooms can resist the crack propagation mechanism effectively and have a good adaptability to nonflat surfaces. ,− However, materials usually suitable for preparing these microstructured devices are chemically inert or have low surface energy (e.g., polyvinylsiloxane, polydimethylsiloxane, polyurethane, and so on), limiting their adhesion ability (especially in the wet environment). − ,− Although the negative pressure microstructure of octopus devices can adhere in the wet state, the poor crack resistance on nonflat substrates and the limitation of materials also reduce its adhesion ability. ,, In addition, almost all gecko’s feet-like switchable adhesive devices mentioned above failed under wet or underwater conditions due to the limitations of their materials. Surface modification of microstructures and coatings mentioned above can improve their adhesion ability, ,,, but these studies only focused on the combined effect of the microstructure and surface chemistry (molecular design), neglecting the role of mechanical deformation and peeling mechanism.…”