Addressing packaging challenges

Adam, J.; Chang, Cheng; Stankus, J.J.; Iyer, M.K.; Chen, W.T.

doi:10.1109/mcd.2002.1021121

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Typical Chip Package Structure and Heat Transfer Mechanisms1

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“…Due to the increase in silicon junction temperature for nanometer-scale technologies, packaging has been transformed from playing the traditional role of a protective mechanical enclosure to a sophisticated thermal management platform [32,33]. Fig.…”

Section: Typical Chip Package Structure and Heat Transfer Mechanismsmentioning

confidence: 99%