Millimeter-Wave Complex Permittivity of Silica/Alumina-Filled Epoxy-Molding Compounds

McGarry, Michael P.; Tuncer, Enis; Lee, Mark

doi:10.1007/s10762-020-00730-1

Cited by 5 publications

(1 citation statement)

References 26 publications

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“…Due to the small size and single purpose, a specialized low-loss substrate with suitable dielectric constant (ε r ) such as alumina and liquid-crystal polymer (LCP) or a flexible material such as polyimide can be selected at low overall cost. High performance MMIC-molding compounds as characterized in [70] may be attractive options for a package-based antenna substrate as well. However, the etching tolerances of PCB technologies can lead to mismatches between designed and measured performance as reported in [41].…”

Section: A Integrated Substrate Technologymentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

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Section: A Integrated Substrate Technologymentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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Silicon Technology Innovation Opportunities for Applications at 0.1 to 1 THz Beyond that for Transistors

Awais,

Tariq

et al. 2023

ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

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CMOS Platform for Everyday Applications Using Submillimeter Electromagnetic Waves

Choi

Zhu

et al. 2023

IEEE Open J. Solid-State Circuits Soc.

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CMOS (Complementary Metal Oxide Silicon) integrated circuits (IC's) technology is emerging as a means for realization of capable and affordable systems that operate at frequencies near 300GHz and higher. This is lowering a key barrier for utilizing the sub-millimeter electromagnetic waves in everyday applications. Despite the fact that the unity maximum available gain frequency, f max of NMOS transistors (with connections to the tope metal layer) has peaked at ~320 GHz, signal generation up to 1.33 THz, coherent detection up to 1.2 THz and incoherent detection up to ~10 THz have been demonstrated using CMOS integrated circuits. Furthermore, highly integrated rotational spectroscopy transceivers operating at frequencies up to near 300 GHz, 300-GHz and 400-GHz concurrent transceiver pixels and arrays for high resolution radar imaging, and 300-GHz and 390-GHz transmitters, and 300-GHz receivers for high data-rate communication have been demonstrated in CMOS. The performances of these CMOS circuits are sufficient or close to being sufficient to support electronic smelling using rotational spectroscopy that can detect and quantify concentrations of a wide variety of gases; imaging that can enable operation in a wide range of visually impaired conditions; and high-bandwidth communication. Lastly, techniques for affordable packaging and testing sub-millimeter wave systems are suggested based on experimental demonstrations.

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Millimeter-Wave Complex Permittivity of Silica/Alumina-Filled Epoxy-Molding Compounds

Cited by 5 publications

References 26 publications

A Review of Design and Integration Technologies for D-Band Antennas

A Review of Design and Integration Technologies for D-Band Antennas

Silicon Technology Innovation Opportunities for Applications at 0.1 to 1 THz Beyond that for Transistors

CMOS Platform for Everyday Applications Using Submillimeter Electromagnetic Waves

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