Additively Manufactured mm-Wave Multichip Modules With Fully Printed “Smart” Encapsulation Structures

Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics

“…In [97], an additively manufactured mm-wave front-end module is demonstrated featuring inkjet-printed interconnect technology. Using higher performance inkjet-printed interconnects allows designers to create more efficient systems, integrating multiple chips into compact RF modules.…”

Next-Generation Healthcare: Enabling Technologies for Emerging Bioelectromagnetics Applications

“…These shape-shifting electromagnetic structures offer shielding, filtering and reconfigurability, required for wearable systems in an onbody setting. On the package and die levels, hybrid manufacturing -inkjet and 3D -has enabled the implementation of smart multi-function System on Package (SoP), System in Package (SiP) modules with intelligent interconnects and encapsulation, demonstrating a performance superiority over traditional packaging methods such as ribbon bonds and wire bonds [169]. On the component level, the multilayer deposition of materials with different conductive properties allowed the realization of fully-printed passive and active devices in additive to ultrasensitive chemical, gas, humidity, and temperature sensors based on printed functionalized carbon-nanotubes (CNTs) ink [9].…”

Additively manufactured frequency selective surface for gain enhancement of sub‐6 GHzmonopole antenna

“…Such modeling eliminates the need for free-standing bond wires and improves component reliability. 26 The current study aims to highlight the advantages of using AM instead of standard PCB manufacturing, for frequency selective surface (FSS) prototyping. The FSS 27 is a periodic surface which has wide range of applications [28][29][30] as a reflector, absorber, polarizer and so forth.…”

“…By choosing appropriate AM techniques, an entire chip module can also be prototyped. Such modeling eliminates the need for free‐standing bond wires and improves component reliability 26 …”